Patents by Inventor James Salzman

James Salzman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070128821
    Abstract: A transformer system includes a package substrate having a surface. A plurality of electrically conductive pads are arranged in spaced apart relationship relative to each other on the substrate surface. A first winding is defined by a first electrically conductive path between a first input and a first output, the first electrically conductive path including at least one wire connected between at least one first pad pair of the electrically conductive pads. At least one electrically conductive pad of each first pad pair is at the substrate surface. A,second winding is defined by a second electrically conductive path between a second input and a second output, the second electrically conductive path including at least one wire connected between at least one second pad pair of the electrically conductive pads. At least one electrically conductive pad of each second pad pair is at the substrate surface.
    Type: Application
    Filed: December 5, 2005
    Publication date: June 7, 2007
    Inventors: See Lee, Solti Peng, Dirk Leipold, James Salzman
  • Publication number: 20050208925
    Abstract: In one embodiment, an automated emergency alert system includes a handheld portable communication device operable to initiate communication over a wireless telecommunications network, a dynamic sensor operable to generate an acceleration profile for the device, and a memory operable to store one or more predefined acceleration profiles each associated with an emergency event.
    Type: Application
    Filed: March 16, 2004
    Publication date: September 22, 2005
    Inventors: Carl Panasik, James Salzman
  • Publication number: 20050206015
    Abstract: In one embodiment, an integrated circuit structure includes one or more integrated circuit elements operable to generate an electromagnetic field when an electric current is applied to the integrated circuit element. The structure also includes an encapsulating compound substantially surrounding the one or more integrated circuit elements. The encapsulating compound includes a packaging material and an electromagnetic field-attenuating material operable to attenuate the electromagnetic field emitted by one or more of the integrated circuit elements, the electromagnetic field-attenuating material disposed within at least a portion of the packaging material.
    Type: Application
    Filed: March 16, 2004
    Publication date: September 22, 2005
    Inventors: James Salzman, Carl Panasik