Patents by Inventor James Santiago

James Santiago has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11991277
    Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: May 21, 2024
    Assignee: International Business Machines Corporation
    Inventors: Arthur J. Higby, David Clifford Long, Edward N. Cohen, John R. Dangler, Matthew Doyle, Philipp K. Buchling Rego, William Santiago-Fernandez, Levi Campbell, James Busby
  • Publication number: 20240121890
    Abstract: A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.
    Type: Application
    Filed: October 10, 2022
    Publication date: April 11, 2024
    Inventors: Arthur J. Higby, DAVID CLIFFORD LONG, James Busby, William Santiago-Fernandez, John R. Dangler, Russell A. Budd, Philipp K Buchling Rego, Hannah Wendling, Lauren Boston
  • Publication number: 20070117414
    Abstract: In a first aspect, a first system is provided for semiconductor device manufacturing. The first system includes (1) an epitaxial chamber adapted to form a material layer on a surface of a substrate; and (2) a plasma generator coupled to the epitaxial chamber and adapted to introduce plasma to the epitaxial chamber. Numerous other aspects are provided.
    Type: Application
    Filed: October 3, 2006
    Publication date: May 24, 2007
    Inventors: Stephen Moffatt, James Santiago