Patents by Inventor James Scott Sutherland

James Scott Sutherland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210373245
    Abstract: A passively aligned fan-out apparatus for a multicore fiber (MCF) includes a fan-out assembly that comprises a fan-out substrate, small-clad fibers (SCFs) supported in SCF V-grooves of the fan-out substrate, and alignment rods disposed outboard alignment V-grooves of the fan-out substrate. The SCFs have a distal-end pitch P2D at a distal end of the fan-out substrate greater than the proximal-end pitch P2P of the SCFs at a proximal end of the fan-out substrate. An MCF assembly and/or single mode fiber (SMF) assembly may also be provided as part of the fan-out apparatus.
    Type: Application
    Filed: May 17, 2021
    Publication date: December 2, 2021
    Inventors: Douglas Llewellyn Butler, James Scott Sutherland, Aramais Robert Zkharian
  • Publication number: 20210341679
    Abstract: A fiber optic assembly is provided including a support substrate having a substantially planar surface, a signal-fiber array supported on the planar surface of the support substrate. The signal-fiber array including a plurality of optical fibers and an adhesive disposed on the plurality of optical fibers and the support substrate. Each of the optical fibers is spaced from adjacent optical fibers of the plurality of optical fibers at a precise pitch.
    Type: Application
    Filed: April 16, 2021
    Publication date: November 4, 2021
    Inventors: Alexander Lee Cuno, JR., James Scott Sutherland
  • Publication number: 20210341691
    Abstract: A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.
    Type: Application
    Filed: April 16, 2021
    Publication date: November 4, 2021
    Inventor: James Scott Sutherland
  • Publication number: 20210341669
    Abstract: A method for fabrication a multifiber cable assembly is provided. The method includes selecting a plurality of optical fibers that each have a respective cladding diameter, determining a maximum fiber core position error for the plurality of optical fibers in a plurality of configurations, and determining a desired order of the plurality of optical fibers that minimizes the maximum fiber position total error.
    Type: Application
    Filed: April 16, 2021
    Publication date: November 4, 2021
    Inventor: James Scott Sutherland
  • Publication number: 20210341678
    Abstract: A fiber optic assembly is provided including a support substrate having a substantially flat surface and a signal-fiber array supported on the support substrate. The signal-fiber array includes a plurality of optical fibers. Al least some of the optical fiber of the plurality of optical fibers includes a first datum contact disposed between the optical fiber and an adjacent optical fiber and each of the optical fibers of the plurality of optical fibers includes a second datum contact disposed between each of the optical fibers of the plurality of optical fibers and the support substrate. A first datum surface is disposed at a top surface of each of the plurality of optical fibers opposite the support surface.
    Type: Application
    Filed: April 16, 2021
    Publication date: November 4, 2021
    Inventors: Douglas Llewellyn Butler, Alexander Lee Cuno, Alan Frank Evans, Hailey Perraut, James Scott Sutherland
  • Publication number: 20210302664
    Abstract: Lens-based optical connector assemblies and methods of fabricating the same are disclosed. In one embodiment, a lens-based connector assembly includes a glass-based optical substrate includes at least one optical element within the optical substrate, and at least one alignment feature positioned at an edge of the glass-based optical substrate, wherein the at least one alignment feature is located within 0.4 ?m of a predetermined position with respect to the at least one optical element along an x-direction and a y-direction. The lens-based connector assembly further includes a connector element including a recess having an interior surface, The interior surface has at least one connector alignment feature. The glass-based optical substrate is disposed within the recess such that the at least one alignment feature of the glass-based optical substrate engages the at least one connector alignment feature.
    Type: Application
    Filed: June 10, 2021
    Publication date: September 30, 2021
    Inventors: Jeffery Alan DeMeritt, James Scott Sutherland
  • Patent number: 11105985
    Abstract: Lens-based optical connector assemblies and methods of fabricating the same are disclosed. In one embodiment, a lens-based connector assembly includes a glass-based optical substrate includes at least one optical element within the optical substrate, and at least one alignment feature positioned at an edge of the glass-based optical substrate, wherein the at least one alignment feature is located within 0.4 ?m of a predetermined position with respect to the at least one optical element along an x-direction and a y-direction. The lens-based connector assembly further includes a connector element including a recess having an interior surface, The interior surface has at least one connector alignment feature. The glass-based optical substrate is disposed within the recess such that the at least one alignment feature of the glass-based optical substrate engages the at least one connector alignment feature.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: August 31, 2021
    Assignee: Corning Research & Development Corporation
    Inventors: Jeffery Alan DeMeritt, James Scott Sutherland
  • Publication number: 20210255402
    Abstract: Fiber optic connectors and junctions between fiber optic connectors include ferrules terminating a plurality of optical fibers, the ferrules having a ferrule keying portion that rotationally aligns and constrains the ferrules with a guide keying portion of an annular guide tube. The ferrules may further aligned and constrained and aligned in a lateral direction with a ferrule sleeve in the junction of connectors. Each of the ferrule sleeve and the guide keying portion individually constrain movement of the ferrules in different dimensions, the guide keying portion rotationally aligning and constraining the ferrules, while allowing freedom of movement in a lateral direction, and the ferrule sleeve aligning and constraining the ferrules in the lateral direction, while allowing rotational freedom of movement.
    Type: Application
    Filed: April 12, 2021
    Publication date: August 19, 2021
    Inventors: James Scott Sutherland, Thomas Theuerkorn
  • Publication number: 20210239912
    Abstract: Ferrule assemblies having a lens array are disclosed. In one embodiment, a ferrule assembly includes a ferrule body and a fiber array ferrule. The ferrule body includes a first end face and a second end face, at least one cavity for receiving one or more optical fibers disposed between the first end face and the second end face, and at least one body alignment feature at an outer surface of the body. The fiber array ferrule includes a first end face and a second end face, an array of alignment holes extending between the first end face and the second end face, and at least one ferrule alignment feature at an outer perimeter of the fiber array ferrule. The second end face of the fiber array ferrule is coupled to the first end face of the body.
    Type: Application
    Filed: January 31, 2020
    Publication date: August 5, 2021
    Inventors: Jeffery Alan DeMeritt, James Scott Sutherland
  • Publication number: 20210239915
    Abstract: Lens-based optical connector assemblies and methods of fabricating the same are disclosed. In one embodiment, a lens-based connector assembly includes a glass-based optical substrate includes at least one optical element within the optical substrate, and at least one alignment feature positioned at an edge of the glass-based optical substrate, wherein the at least one alignment feature is located within 0.4 ?m of a predetermined position with respect to the at least one optical element along an x-direction and a y-direction. The lens-based connector assembly further includes a connector element including a recess having an interior surface, The interior surface has at least one connector alignment feature. The glass-based optical substrate is disposed within the recess such that the at least one alignment feature of the glass-based optical substrate engages the at least one connector alignment feature.
    Type: Application
    Filed: January 31, 2020
    Publication date: August 5, 2021
    Inventors: Jeffery Alan DeMerritt, James Scott Sutherland
  • Publication number: 20210157056
    Abstract: Optical fiber photonic integrated chip connector interfaces and photonic integrated chip assemblies utilizing low-profile optical fibers and methods thereof are disclosed. In one embodiment, an optical fiber photonic integrated chip (PIC) connector interface includes at least one low-profile optical fiber having an end face, at least one core, and a cladding layer, wherein the end face is non-rotationally symmetric with respect to the at least one core, and the cladding layer includes at least one minimum perimeter point that is a minimum distance from the at least one core as compared to remaining perimeter points of the cladding. The PIC connector interface further includes an interconnect substrate including a fiber mounting surface, and a mechanical coupling surface. The at least one low-profile optical fiber is disposed on the fiber mounting surface such that one or more surfaces of the cladding defining the at least one minimum perimeter point faces away from the fiber mounting surface.
    Type: Application
    Filed: November 22, 2019
    Publication date: May 27, 2021
    Inventors: Douglas Llewellyn Butler, Alan Frank Evans, James Scott Sutherland
  • Publication number: 20210159347
    Abstract: A method for assembling an optoelectronic package assembly includes engaging a connector holder with a substrate, the connector holder defining an engagement feature and the substrate including optical waveguides, engaging a connector of a fiber array unit with the engagement feature the connector holder where the engagement feature retains the connector and where the fiber array unit includes the connector and optical fibers coupled to the connector, optically coupling the optical fibers to the optical waveguides of the substrate, heating the connector holder, the fiber array unit, the substrate, and a solder positioned between the substrate and a base substrate, where the heating is sufficient to melt the solder, and cooling the solder to couple the substrate to the base substrate.
    Type: Application
    Filed: November 2, 2020
    Publication date: May 27, 2021
    Inventors: Douglas Llewellyn Butler, James Scott Sutherland
  • Publication number: 20210149128
    Abstract: Multi-fiber interface apparatuses providing a double reflection expanded beam arrangement include one or more substrates being configured to mountably receive a photonic integrated circuit (PIC), a fiber array coupling member mounted to a substrate, optical elements associated with the substrate and/or the fiber array coupling member, and one or more additional features. An additional feature according to certain implementations includes one or more passive substrate alignment features for aligning substrates to promote optical coupling between optical fibers and the PIC. In certain implementations configured for interfacing with printed circuit boards (PCBs), an additional feature includes a recess defined in an optically transmissive substrate in which a PIC is mounted, or includes a recess defined in a PCB into which the PIC is mounted. Various embodiments provide relaxed fiber alignment tolerances with simplified fabrication and system integration capabilities.
    Type: Application
    Filed: October 1, 2020
    Publication date: May 20, 2021
    Inventors: Rebecca Kayla Schaevitz, James Scott Sutherland, Qi Wu
  • Publication number: 20210103102
    Abstract: Disclosed is an optical interconnection device that includes an alignment ferrule assembly formed from an alignment substrate and optical fibers. The optical interconnection device also has an alignment assembly formed by a planar support member with guide features. A receiving region resides between the guide features in which the alignment substrate is secured. An evanescent optical coupler can be formed using the optical interconnection device as a first device and another optical interconnection device as a second device. The second device is constituted by a planar lightwave circuit that operably supports waveguides and an adapter. The adapter of the second device is configured to engage the alignment assembly of the first device to place the optical fibers and the optical waveguides of the respective devices in evanescent optical communication.
    Type: Application
    Filed: December 17, 2020
    Publication date: April 8, 2021
    Inventor: James Scott Sutherland
  • Publication number: 20210096302
    Abstract: Fiber array spacers, optical fiber assemblies, optical assemblies, and methods for fabricating optical assemblies are disclosed. In one embodiment, an optical fiber assembly includes a fiber array spacer and a fiber ribbon having an array of optical fibers. The fiber array spacer has an array of spacer fibers, wherein individual spacer fibers of the array of spacer fibers are bonded to one another, and a diameter of the individual spacer fibers determines a height of the fiber array spacer. Each optical fiber of the array of optical fibers has an glass portion. The glass portion of each optical fiber is bonded to the fiber array spacer such that a longitudinal axis of the individual spacer fibers is transverse to a longitudinal axis of individual optical fibers of the fiber ribbon.
    Type: Application
    Filed: September 16, 2020
    Publication date: April 1, 2021
    Inventors: Douglas Llewellyn Butler, James Scott Sutherland
  • Patent number: 10948658
    Abstract: Optical interconnection assemblies, glass interconnection substrates, and methods for making optical connections are disclosed. In one embodiment, an optical interconnection assembly includes a base substrate, a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide having an end surface, an optical chip comprising an optical coupling surface, and a glass interconnection substrate. The glass interconnection substrate includes a first end optically coupled to the end surface of the substrate optical waveguide, a second end optically coupled to the optical coupling surface of the optical chip, and a curved portion disposed between the first end and the second end. The glass interconnection substrate further includes an optical waveguide at least partially positioned within the curved portion.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: March 16, 2021
    Assignee: Corning Optical Communications LLC
    Inventors: Chenueh Abongwa Florian Lohse, James Scott Sutherland
  • Publication number: 20210018697
    Abstract: Waveguide substrates, waveguide substrate assemblies, and methods for fabricating waveguide substrates are disclosed. In one embodiment, a waveguide substrate includes an input edge, an output edge, and at least one waveguide within the waveguide substrate. The waveguide substrate further includes at least one input alignment feature within the input edge adjacent to the input end of the at least one waveguide, wherein the at least one input alignment feature is fabricated from a material of the waveguide substrate. The waveguide substrate may also include at least one output alignment feature within the input edge adjacent to the output end of the at least one waveguide, wherein the at least one output alignment feature is fabricated from the material of the waveguide substrate.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 21, 2021
    Inventors: Alan Frank Evans, Micah Colen Isenhour, Christopher Paul Lewallen, James Scott Sutherland
  • Patent number: 10895687
    Abstract: Disclosed is an optical interconnection device that includes an alignment ferrule assembly formed from an alignment substrate and optical fibers. The optical interconnection device also has an alignment assembly formed by a planar support member with guide features. A receiving region resides between the guide features in which the alignment substrate is secured. An evanescent optical coupler can be formed using the optical interconnection device as a first device and another optical interconnection device as a second device. The second device is constituted by a planar lightwave circuit that operably supports waveguides and an adapter. The adapter of the second device is configured to engage the alignment assembly of the first device to place the optical fibers and the optical waveguides of the respective devices in evanescent optical communication.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: January 19, 2021
    Assignee: Corning Research & Development Corporation
    Inventor: James Scott Sutherland
  • Publication number: 20210011229
    Abstract: Waveguide substrate, waveguide substrate assemblies and methods of fabricating waveguide substrates having various waveguide routing schemes are disclosed. In one embodiment, a waveguide substrate includes a first surface and a second surface, and a plurality of waveguides within the waveguide substrate. The plurality of waveguides defines a plurality of inputs at the first surface. A subset of the plurality of waveguides extends to the second surface to at least partially define a plurality of outputs at the second surface. In one waveguide routing scheme, at least one branching waveguide extends between one of the first surface and the second surface to a surface other than the first surface and the second surface. Another waveguide routing scheme arranges the plurality of waveguides into optical receive-transmit pairs for duplex pairing of optical signals.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 14, 2021
    Inventors: Alan Frank Evans, Christian Fiebig, Claudio Mazzali, James Scott Sutherland
  • Patent number: 10816735
    Abstract: Optical assemblies and lensed connector ferrule assemblies having one or more optical fibers aligned to one or more lenses of a lens substrate and methods of their manufacture are disclosed. In one embodiment, an optical assembly includes a ferrule and a mirror surface. The ferrule includes a lens holder having a lens substrate cavity and an engagement surface. The ferrule further includes a lens substrate disposed within the lens substrate cavity. The lens substrate has at least one lens. The mirror surface is coupled to the engagement surface such that the at least one lens is offset from the mirror surface by an offset distance.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: October 27, 2020
    Assignee: Corning Research & Development Corporation
    Inventors: Alexander Lee Cuno, Oberon Denaci Deichmann, Davide Domenico Fortusini, Wei Jiang, William James Miller, James Scott Sutherland