Patents by Inventor James Seruto

James Seruto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9024349
    Abstract: Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: May 5, 2015
    Assignee: Cree, Inc.
    Inventors: Ashay Chitnis, James Ibbetson, Arpan Chakraborty, Eric J. Tarsa, Bernd Keller, James Seruto, Yankun Fu
  • Publication number: 20080179611
    Abstract: Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
    Type: Application
    Filed: September 7, 2007
    Publication date: July 31, 2008
    Inventors: Ashay Chitnis, James Ibbetson, Bernd Keller, David T. Emerson, John Edmond, Michael J. Bergmann, Jasper S. Cabalu, Jeffrey C. Britt, Arpan Chakraborty, Eric Tarsa, James Seruto, Yankun Fu
  • Publication number: 20080173884
    Abstract: Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
    Type: Application
    Filed: January 22, 2007
    Publication date: July 24, 2008
    Inventors: Ashay Chitnis, James Ibbetson, Arpan Chakraborty, Eric J. Tarsa, Bernd Keller, James Seruto, Yankun Fu
  • Publication number: 20040012027
    Abstract: A high efficiency, high yield solid state emitter package is disclosed exhibiting limited wavelength variations between batches and consistent wavelength and emission characteristics with operation. One embodiment of an emitter package according to the present invention comprises a semiconductor emitter and a conversion material. The conversion material is arranged to absorb substantially all of the light emitting from the semiconductor emitter and re-emit light at one or more different wavelength spectrums of light The conversion material is also arranged so that there is not an excess of conversion material to block the re-emitted light as it emits from the emitter package. The emitter package emitting light at one or more wavelength spectrums from the conversion material's re-emitted light.
    Type: Application
    Filed: June 12, 2003
    Publication date: January 22, 2004
    Applicant: CREE LIGHTING COMPANY
    Inventors: Bernd Keller, James Ibbetson, Yankun Fu, James Seruto, Jayesh Bharathan