Patents by Inventor James Shirck

James Shirck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070148997
    Abstract: Provided is an article having a flexible polymeric substrate with an electrically conductive trace having a region with different material properties than the remainder of the trace.
    Type: Application
    Filed: December 22, 2005
    Publication date: June 28, 2007
    Inventors: Steven Feldman, James Shirck
  • Publication number: 20070138405
    Abstract: Provided is a method for removing organic residue from an electronic device substrate by exposure to a corona discharge.
    Type: Application
    Filed: December 16, 2005
    Publication date: June 21, 2007
    Inventors: James Shirck, David Lu, Seth Kirk, Gene Nesmith
  • Publication number: 20060289299
    Abstract: A current probe for measuring electrodeposition plating currents. The current monitoring probe includes a conductive layer located on a front face of the current monitoring probe, an insulating layer behind the conductive layer, and a plurality of current sensing circuits located behind the insulating layer. The insulating layer isolates the current sensing circuits from the conductive layer. A plurality of apertures are formed through the conductive layer and the insulating layer, each aperture exposing one of the plurality of current sensing circuits to metal ions incident to the aperture.
    Type: Application
    Filed: June 22, 2005
    Publication date: December 28, 2006
    Inventors: Stephen LeBlanc, Gene Nesmith, James Shirck
  • Publication number: 20060131700
    Abstract: The present invention includes an electronic-circuit article that has a substrate, a plasma deposited layer disposed on the substrate, where the plasma deposited layer comprises at least about 10.0 atomic percent, and a patterned conductive layer disposed above the plasma deposited layer.
    Type: Application
    Filed: December 22, 2004
    Publication date: June 22, 2006
    Inventors: Moses David, Catharine Shay, Badri Veeraraghavan, Hideo Yamazaki, James Shirck
  • Publication number: 20060134914
    Abstract: Disclosed is a method for making flexible circuits in which portions of a tie layer are removed by etching the underlying polymer. Also disclosed are flexible circuits made by this method.
    Type: Application
    Filed: December 6, 2005
    Publication date: June 22, 2006
    Inventors: Sridhar Dasaratha, James McHattie, James Shirck, Hideo Yamazaki, Yuji Hiroshige, Makoto Sekiguchi