Patents by Inventor James Siekkinen

James Siekkinen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6912759
    Abstract: A method for forming a sensor including the steps of providing a base wafer and forming a sensor cavity in the base wafer. The method further includes the step of coupling a diaphragm wafer to the base wafer, the diaphragm wafer including a diaphragm portion and a sacrificial portion. The diaphragm wafer is coupled to the base wafer such the diaphragm portion generally covers the sensor cavity. The method further includes the steps of reducing the thickness of the diaphragm wafer by removing the sacrificial portion, and forming or locating at least one piezo resistive portion on the diaphragm portion.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: July 5, 2005
    Assignee: Rosemount Aerospace Inc.
    Inventors: Alain Izadnegahdar, James Siekkinen, Horacio V. Estrada, Brad Boggs, Michael Nagy, Kevin Stark
  • Publication number: 20030029245
    Abstract: A method for forming a sensor including the steps of providing a base wafer and forming a sensor cavity in the base wafer. The method further includes the step of coupling a diaphragm wafer to the base wafer, the diaphragm wafer including a diaphragm portion and a sacrificial portion. The diaphragm wafer is coupled to the base wafer such the diaphragm portion generally covers the sensor cavity. The method further includes the steps of reducing the thickness of the diaphragm wafer by removing the sacrificial portion, and forming or locating at least one piezo resistive portion on the diaphragm portion.
    Type: Application
    Filed: July 20, 2001
    Publication date: February 13, 2003
    Inventors: Alain Izadnegahdar, James Siekkinen, Horacio V. Estrada, Brad Boggs, Michael Nagy, Kevin Stark