Abstract: A method for removing moisture and contaminants, at the monolayer level, from the surface of planar and non-planar objects such as semiconductor wafers or corrugated epitaxial layers. The apparatus comprises of two process chambers. Each chamber contains a selected solvent. The interior of each chamber is saturated with the vapors from their respective solvents. The first solvent of the first process chamber has a boiling point much lower than the boiling points of the second solvent in the second process chamber and a rinsing solvent. Vapors from the first solvent displace the rinsing solvent. Vapors from the second solvent displace the first solvent and any other contaminants; the second solvent is then removed resulting in a dry, contaminant free surface.