Patents by Inventor James Spehar
James Spehar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10346339Abstract: A device can be configured to provide isolation between conductive circuit paths and to selectively connect one of the conductive circuit paths to a shared interface. Each conductive circuit path can include driver circuitry designed to transmit signals according to a particular protocol and a corresponding signal speed. The shared interface can be, in one instance, a connector designed for connection to other devices. The other devices can be configured to communicate over the shared interface using one or more of the particular protocols provided using the different circuit paths.Type: GrantFiled: October 22, 2015Date of Patent: July 9, 2019Assignee: NXP B.V.Inventors: James Spehar, Jingsong Zhou, Madan Vemula
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Patent number: 9537462Abstract: Aspects of the present disclosure are directed to addressing impedance-matching issues. As may be implemented in connection with one or more embodiments, an apparatus includes an integrated circuit (IC) chip having a signal-connection terminal and processing circuitry that passes signals along a communication path that is within the IC chip and connected to the signal-connection terminal. Impedance-matching circuitry operates to provide impedance-matching for the communication path, therein mitigating signal loss due to impedance-mismatching. A chip-mounting structure secures the IC chip and electrically connects thereto at the signal-connection terminal.Type: GrantFiled: May 23, 2014Date of Patent: January 3, 2017Assignee: NXP, B.V.Inventors: Madan Vemula, James Spehar
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Patent number: 9430604Abstract: Various example embodiments are directed to methods and apparatuses for implementing a circuit design within an integrated circuit (IC) package. A respective capacitance is determined for each die contact of a circuit design. A respective target inductance range is selected for each of the plurality of die contacts based on the determined capacitance. A segmentation of the circuit design is determined as a function of the target inductance ranges. The segmentation defines an implementation of the circuit design on a plurality of IC dies. The IC dies are placed at respective locations on the substrate, based on the resulting inductances of connections (e.g., conductive traces) between the die contacts and terminals of the IC package.Type: GrantFiled: April 10, 2014Date of Patent: August 30, 2016Assignee: NXP B.V.Inventors: Jong Kim, James Spehar, Xu Zhang
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Publication number: 20160041940Abstract: A device can be configured to provide isolation between conductive circuit paths and to selectively connect one of the conductive circuit paths to a shared interface. Each conductive circuit path can include driver circuitry designed to transmit signals according to a particular protocol and a corresponding signal speed. The shared interface can be, in one instance, a connector designed for connection to other devices. The other devices can be configured to communicate over the shared interface using one or more of the particular protocols provided using the different circuit paths.Type: ApplicationFiled: October 22, 2015Publication date: February 11, 2016Inventors: James Spehar, Jingsong Zhou, Madan Vemula
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Publication number: 20150341013Abstract: Aspects of the present disclosure are directed to addressing impedance-matching issues. As may be implemented in connection with one or more embodiments, an apparatus includes an integrated circuit (IC) chip having a signal-connection terminal and processing circuitry that passes signals along a communication path that is within the IC chip and connected to the signal-connection terminal. Impedance-matching circuitry operates to provide impedance-matching for the communication path, therein mitigating signal loss due to impedance-mismatching. A chip-mounting structure secures the IC chip and electrically connects thereto at the signal-connection terminal.Type: ApplicationFiled: May 23, 2014Publication date: November 26, 2015Applicant: NXP B.V.Inventors: Madan Vemula, James Spehar
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Publication number: 20150169817Abstract: Various example embodiments are directed to methods and apparatuses for implementing a circuit design within an integrated circuit (IC) package. A respective capacitance is determined for each die contact of a circuit design. A respective target inductance range is selected for each of the plurality of die contacts based on the determined capacitance. A segmentation of the circuit design is determined as a function of the target inductance ranges. The segmentation defines an implementation of the circuit design on a plurality of IC dies. The IC dies are placed at respective locations on the substrate, based on the resulting inductances of connections (e.g., conductive traces) between the die contacts and terminals of the IC package.Type: ApplicationFiled: April 10, 2014Publication date: June 18, 2015Applicant: NXP B.V.Inventors: Jong Kim, James Spehar, Xu Zhang
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Patent number: 9025288Abstract: Cross-talk is mitigated in a switching circuit. In accordance with one or more embodiments, an apparatus includes a multi-pin connector having signal-carrying electrodes that communicate with a device external to the apparatus, and respective field-effect switches that couple the signal-carrying electrodes to respective communication channels in the apparatus. The switches include a first field-effect semiconductor switch having a gate electrode adjacent a channel region that connects electrodes (e.g., source and drain regions) when a threshold switching voltage is applied to the gate, in which the electrodes are connected between one of the signal-carrying electrodes and a first channel coupled to an electrostatic discharge (ESD) circuit. A bias circuit mitigates cross-talk between the communication channels by biasing the channel region of the first field-effect semiconductor switch (in an off state) to boost the threshold switching voltage over a threshold discharge voltage of the ESD circuit.Type: GrantFiled: March 15, 2013Date of Patent: May 5, 2015Assignee: NXP B.V.Inventors: Madan Vemula, James Caravella, James Spehar, Gerrit Willem den Besten
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Publication number: 20140268445Abstract: Cross-talk is mitigated in a switching circuit. In accordance with one or more embodiments, an apparatus includes a multi-pin connector having signal-carrying electrodes that communicate with a device external to the apparatus, and respective field-effect switches that couple the signal-carrying electrodes to respective communication channels in the apparatus. The switches include a first field-effect semiconductor switch having a gate electrode adjacent a channel region that connects electrodes (e.g., source and drain regions) when a threshold switching voltage is applied to the gate, in which the electrodes are connected between one of the signal-carrying electrodes and a first channel coupled to an electrostatic discharge (ESD) circuit. A bias circuit mitigates cross-talk between the communication channels by biasing the channel region of the first field-effect semiconductor switch (in an off state) to boost the threshold switching voltage over a threshold discharge voltage of the ESD circuit.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: NXP B.V.Inventors: Madan Vemula, James Caravella, James Spehar, Gerrit Willem den Besten
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Publication number: 20140247720Abstract: A device can be configured to provide isolation between conductive circuit paths and to selectively connect one of the conductive circuit paths to a shared interface. Each conductive circuit path can include driver circuitry designed to transmit signals according to a particular protocol and a corresponding signal speed. The shared interface can be, in one instance, a connector designed for connection to other devices. The other devices can be configured to communicate over the shared interface using one or more of the particular protocols provided using the different circuit paths.Type: ApplicationFiled: March 1, 2013Publication date: September 4, 2014Applicant: NXP B.V.Inventors: James Spehar, Jingsong Zhou, Madan Vemula