Abstract: A system for probe-less non-invasive detection of electrical signals from integrated circuit devices is disclosed. The system includes an illumination source, collection optics, imaging optics, and a photon sensor. In a navigation mode, the light source is activated and the imaging optics is used to identify the target area on the chip and appropriately position the collection optics. Once the collection optics is appropriately positioned, the light source is deactivated and the photon sensor is used to detect photons emitted from the chip. No mention of cooling (active device measurement capability) and advanced optics to detect the features (SIL).

Abstract: A system for probe-less non-invasive detection of electrical signals from integrated circuit devices is disclosed. The system includes an illumination source, collection optics, imaging optics, and a photon sensor. In a navigation mode, the light source is activated and the imaging optics is used to identify the target area on the chip and appropriately position the collection optics. Once the collection optics is appropriately positioned, the light source is deactivated and the photon sensor is used to detect photons emitted from the chip. No mention of cooling (active device measurement capability) and advanced optics to detect the features (SIL).

Abstract: A system for probe-less non-invasive detection of electrical signals from integrated circuit devices is disclosed. The system includes an illumination source, collection optics, imaging optics, and a photon sensor. In a navigation mode, the light source is activated and the imaging optics is used to identify the target area on the chip and appropriately position the collection optics. Once the collection optics is appropriately positioned, the light source is deactivated and the photon sensor is used to detect photons emitted from the chip. No mention of cooling (active device measurement capability) and advanced optics to detect the features (SIL).

Abstract: A system for probe-less non-invasive detection of electrical signals from integrated circuit devices is disclosed. The system includes an illumination source, collection optics, imaging optics, and a photon sensor. In a navigation mode, the light source is activated and the imaging optics is used to identify the target area on the chip and appropriately position the collection optics. Once the collection optics is appropriately positioned, the light source is deactivated and the photon sensor is used to detect photons emitted from the chip. No mention of cooling (active device measurement capability) and advanced optics to detect the features (SIL).

Abstract: A system for probe-less non-invasive detection of electrical signals from integrated circuit devices is disclosed. The system includes an illumination source, collection optics, imaging optics, and a photon sensor. In a navigation mode, the light source is activated and the imaging optics is used to identify the target area on the chip and appropriately position the collection optics. Once the collection optics is appropriately positioned, the light source is deactivated and the photon sensor is used to detect photons emitted from the chip. No mention of cooling (active device measurement capability) and advanced optics to detect the features (SIL).

Abstract: A Bi-Linear CCD Array is used to locate the centroid of a charge cloud produced by an MCP stack. Preferably, an anode comprises a checkerboard-like structure of x- and y- conductive pads. The x-pads are connected in columns and feed charge into x-charge buckets via a FET pass gate. The y-pads are connected in rows and feed charge into y- charge buckets via an FET gate. A conductive area collects charge that misses the x- or y- pads and is used to sense the arrival of a charge cloud. The x- and y-charge buckets, under the influence of x- and y-shift circuitry, pass their charge to x- and y-charge amplifiers. X- and y- counters keep track of the number of x- and y- shifts that occur before x- and y-detectors, connected to the x- and y-charge amplifier outputs respectively, locate the x- and y-bucket containing the most charge. Latching the x- and y-counter values when the respective x- and y-peaks occur captures the centroid coordinates of the charge cloud.