Abstract: A housing is described which is configured to dissipate heat from one or more heat sources within the housing and which comprises and inner layer and an outer layer. The outer layer comprises a material with a lower thermal conductivity than the inner layer. The outer layer is configured to have an overall thermal insulance of at least 2.5×10?3 Km2 W?1 at 20° C. A part of the inner layer and a part of the outer layer are spaced apart from each other and define a receptacle for wireless communication components. In another embodiment the housing comprises an air gap between the inner layer and the outer layer. The air gap and the outer layer together are configured to have an overall thermal insulance of at least 2.5×10?3 Km2 W?1 at 20° C.