Abstract: A method of mounting an integrated circuit die on an inside surface of a cover for an IC package uses a solder preform having isolatable structures that provide connections to a plurality of metalized pads while allowing selective electrical isolation therebetween.

Abstract: A putter for use in the game of golf including a first elongated shaft having a first and a second end, a second elongated shaft having a first end telescopically received within the second end of the first elongated shaft, a putter head fixedly secured to a second end of the second elongated shaft and a securing mechanism for fixing an axial and rotational position of the second elongated shaft with respect to the first elongated shaft. Additionally, the first end of the first elongated includes a mechanism for stabilizing the first elongated shaft with respect to the body of the user. Particularly, the stabilizer is received under an arm of the user and is capable of supporting the weight of the user should the user require assistance in walking or utilizing the putter. The putter may include a first elongated shaft in the form of a conventional putter which is received within a second shaft in the form of an upper portion of a quad cane.