Abstract: A method of mounting an integrated circuit die on an inside surface of a cover for an IC package uses a solder preform having isolatable structures that provide connections to a plurality of metalized pads while allowing selective electrical isolation therebetween.

Abstract: A hermetically sealed protective package for a space-deployable electronic circuit includes a pressure relief valve. The pressure relief valve is closed during assembly and testing of the circuit in an earth borne environment, so as to prevent the entry of moisture and foreign matter and maintain pressure equalization between the interior volume and the exterior of the hermetically sealed package. The valve is opened when the package is placed in the ‘clean’ vacuum ambient of a spaceborne environment, so as to vent atmospheric pressure from the interior volume of the package and prevent differential pressure-induced stresses on the package.

Abstract: A putter for use in the game of golf including a first elongated shaft having a first and a second end, a second elongated shaft having a first end telescopically received within the second end of the first elongated shaft, a putter head fixedly secured to a second end of the second elongated shaft and a securing mechanism for fixing an axial and rotational position of the second elongated shaft with respect to the first elongated shaft. Additionally, the first end of the first elongated includes a mechanism for stabilizing the first elongated shaft with respect to the body of the user. Particularly, the stabilizer is received under an arm of the user and is capable of supporting the weight of the user should the user require assistance in walking or utilizing the putter. The putter may include a first elongated shaft in the form of a conventional putter which is received within a second shaft in the form of an upper portion of a quad cane.

Abstract: A method is for making a chip package of a type including a carrier and a chip connected thereto using optical alignment techniques. One method includes the steps of: providing a transparent film having chip alignment and carrier alignment indicia thereon, optically detecting the chip through the transparent film and aligning the transparent film and the chip based upon the chip alignment indicia. Similarly, the method may include optically detecting the carrier through the transparent film and aligning the transparent film and the carrier based upon the carrier alignment indicia. In addition, the method further includes securing the chip, transparent film and carrier together, such as by providing a thermoplastic transparent film which may heated for adhesively securing the components. The transparent film may be a transparent z-axis conductive film, or a dielectric transparent film.

Abstract: An integrated circuit device, such as a fingerprint sensing device, includes an integrated circuit die, a body of encapsulating material surrounding the integrated circuit die and having an opening therein exposing a portion of the integrated circuit die, and an electrically conductive member or frame being mounted to the body of encapsulating material adjacent the opening therein. The electrically conductive member may preferably be positioned so as to define at least a portion of a frame for the opening in the body of encapsulating material. The electrically conductive member may be adhesively secured to the integrated circuit die. Accordingly, the adhesive and electrically conductive member may serve as a seal to the interface between the body of encapsulating material and the die. The electrically conductive member may define a frame that surrounds a body of removable material during an intermediate stage in manufacturing.