Abstract: Anaerobic adhesive compositions have been developed that are very thermally stable, and are also extremely hydrophobic to allow for formulations that can withstand extreme harsh temperature, pressure and moisture environments.

Abstract: The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.

Abstract: The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.

Abstract: The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.

Abstract: A method of forming a bonded shingle stacked die package is provided. The method includes providing a wafer, singulating the wafer into a plurality of strips, applying to at least a portion of at least one mating surface of each of the plurality of strips a material capable of reacting with the other mating surface, stacking the plurality of strips in an overlapping stair-step configuration, exposing the stacked strips to conditions sufficient to bond the plurality of strips together, and dicing the stacked strips into individual die shingle stack configurations.

Abstract: The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof.

Abstract: Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.

Abstract: The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

Abstract: Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.

Abstract: The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

Abstract: In a method for making a printed circuit board employing an aqueous type photoresist and including etching of the substrate surface with chromic acid after application of the photoresist mask, chromium is washed from the surface with a reducing agent at a pH of .ltoreq.10.

Abstract: A method of forming a flexible printed wiring board having a metal substrate includes the steps of etching through-holes in the metal substrate by means of an etch resistant ferro electric mask placed over the substrate and employing a viscous sealant such as polyethylene or polypropylene glycol between the mask and the substrate. The mask is held to the substrate with the sealant therebetween by means of a magnetic field. The substrate is then treated with a ferric chloride etch solution to etch away the desired through-holes in the metal substrate. Thereafter, the substrate may be coated with a polymeric coated by means of fluidized bed or electrostatic coating techniques as taught in the prior art.