Patents by Inventor James T. Kuechmann

James T. Kuechmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating reactor including back-side electrical contact apparatus
    Patent number: 6849167
    Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: February 1, 2005
    Assignee: Semitool, Inc.
    Inventors: Daniel J. Woodruff, Kyle M. Hanson, Robert W. Batz, Jr., James T. Kuechmann
  • Electroplating reactor including back-side electrical contact apparatus
    Publication number: 20040222086
    Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.
    Type: Application
    Filed: January 7, 2003
    Publication date: November 11, 2004
    Inventors: Daniel J. Woodruff, Kyle M. Hanson, Robert W. Batz, James T. Kuechmann
  • Electroplating reactor including back-side electrical contact apparatus
    Patent number: 6527926
    Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: March 4, 2003
    Assignee: Semitool, Inc.
    Inventors: Daniel J. Woodruff, Kyle M. Hanson, Robert W. Batz, Jr., James T. Kuechmann
  • Electroplating reactor including back-side electrical contact apparatus
    Publication number: 20010052457
    Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.
    Type: Application
    Filed: March 13, 2001
    Publication date: December 20, 2001
    Inventors: Daniel J. Woodruff, Kyle M. Hanson, Robert W. Batz, James T. Kuechmann