Abstract: A glass cullet separator utilizes a multi-element optical sensor to detect when an opaque particle in a group primarily composed of transparent particles moving along a plane passes a first line lying in that plane, and the particular location of the particle along the first line. A signal from the optical sensor is fed to a microprocessor. After a delay equal to the time it takes for a particle to pass between the first line and a second line, which is parallel to and separated from the first line, the microprocessor causes a valve to open and emit a jet of high velocity air from a nozzle aimed toward the plane along the second line. The jet of air blows the opaque particle out of the plane where it is captured and separated from the remainder of the particles. A plurality of nozzles are located in a manifold which extends across the extent of the second line. The manifold also supports the valves and fluid conduits that interconnect the valves and the nozzles.

Abstract: A wound capacitor end connection is constructed by spraying a first layer of metal onto one end of a capacitor winding, positioning strands of a stranded conductor adjacent to the first layer, without mechanically securing the strands to the first layer, and spraying a second layer of metal over the strands and first layer to mechanically and electrically connect the strands to the first layer. In an alternative embodiment, the stranded conductor may be replaced by a perforated conductor having openings which provide additional electrical and mechanical connection points between the two sprayed metal layers.

Abstract: An overcurrent protection system adaptable for use with power controllers the single or multi-phase ac, or dc types includes a load current sensing element in combination with an overcurrent sensing/inverse time delay circuit, a power switch and a crowbar circuit. The system also includes a drive circuit, a drive circuit input current sensor, a trip signal detector and a logic circuit. The overcurrent protection system, according to the present invention, uses the drive circuit to power the overcurrent sensing/inverse time delay circuit, to drive the power switch, and to provide a coupling path for an overcurrent fault signal across electrical isolation interface(s) thereof to the logic circuit. Thus, the need for a separate isolated power supply for powering the overcurrent sensing/inverse time delay circuit and the need for separate optical and/or electromagnetic isolation interfaces for coupling of the overcurrent fault signal are eliminated.

Abstract: A separable plate is utilized for mounting isolated case-type power switching devices for easy replacement in a solid state power controller while providing increased heat transfer in the assembled unit.

Abstract: A solid state circuit breaker is provided with circuitry for permitting off/on/reset operations actuated by mechanical toggle switch for close simulation of magnetic circuit breaker operation in three phase or other multiphase systems. A power continuity feature is provided for load power by locating the control switch so that it opens all of the circuit except the static power switch branch. The control switch is located between two of the supply voltage phases and the power supply for the control circuitry. The correct zero crossover of one phase is utilized to produce turn-on at zero degrees of that one phase while the other two phases are respectively at minus 120.degree. and plus 120.degree. without any significant impairment of overall circuit breaker performance. An overcurrent protection system is included that uses optical isolators with reduced sensing voltages developed directly from terminals of the power switch elements.

Abstract: Solderable conductive strips bonded to ceramic insulator spacers interconnect terminals of adjacent substrates in a microcircuit module. Input-output connector pins are bonded to a selected base substrate and are electrically connected to the conductive strips which serve as through connecting means. Assembly and disassembly are accomplished by a reflow soldering procedure wherein hot gas is applied to the spacer-substrate interface, thereby minimizing the risk of substrate heat damage. The resulting electrical and mechanical connection is more reliable than the connection established by conventional structures having interconnecting pins since pin alignment stresses are eliminated.