Abstract: A process for providing a temporary, non-intrusive electrical connection to bond pads of a semiconductor die permitting test and burn-in of bare die. Modified tape automated bonding (TAB) techniques are used with gold bumped die bond pads for providing known good die (KGD). After test and burn-in, the temporary connection to the die is removed without the need to reform the gold bumps prior to use in a multichip module. Gold inner leads of a TAB tape are diffusion bonded to gold bumps wherein the bonding is sufficient for providing electrical connection during the testing and burn-in of the die yet sufficiently weak for removal of the leads from the die after testing and burn-in. The process provides the KGD necessary for acceptable first assembly yields and long term reliability of multichip modules (MCM). Bare die with gold bumped, sealed bond pads are provided simplifying interconnection during testing and ultimate module use.