Abstract: Systems and methods to manage and mechanize investigations and associated evidence gathering, documentation and retention. Methods for using barcodes for processing and storing evidence in an investigation are provided.

Abstract: A lighting fixture device for a building structure for allowing a user to easily and quickly decorate one's building structure with lights. The lighting fixture device for a building structure includes an elongate storage unit having a top, bottom, and side walls, and also having a storage compartment therein with the bottom wall having an opening disposed therethrough and with the elongate storage unit being adapted to securely mount to the building structure; and also includes a cover member being removably closed over the opening of the elongate storage unit; and further includes a light-emitting assembly being removably stored in the elongate storage unit; and also includes an assembly for securely supporting the light-emitting assembly in the elongate storage unit.

Abstract: A lighting fixture device for a building structure for allowing a user to easily and quickly decorate one's building structure with lights. The lighting fixture device for a building structure includes an elongate storage unit having a top, bottom, and side walls, and also having a storage compartment therein with the bottom wall having an opening disposed therethrough and with the elongate storage unit being adapted to securely mount to the building structure; and also includes a cover member being removably closed over the opening of the elongate storage unit; and further includes a light-emitting assembly being removably stored in the elongate storage unit; and also includes an assembly for securely supporting the light-emitting assembly in the elongate storage unit.

Abstract: In the fabrication of a circuit device including a substrate for providing connections between connection pins to be bonded to I/O pads on one side of the substrate and chips to be bonded to pads on the other side of the substrate, bonding is achieved simultaneously on both sides of the substrate by using a pin holder on an upper side of the substrate and using the surface tension of a flux to adhere and finely position the chips on the lower side of the substrate. The same or a modified technique may be used for the replacement of chips during repair of the circuit device. Repair of damaged or defective pin bonds yields a bond which is structurally and electrically improved in comparison with the originally formed bond.