Abstract: Systems and methods disclosed herein provide, for some embodiments, infrared cameras and target position acquisition techniques for various applications. For example, in one embodiment, a system may include a portable imaging/viewing subsystem having a target position finder and may also include a fixed mount camera subsystem having a camera and a camera positioner. A communications link may be configured to communicate a signal from the target position finder to the camera positioner. The signal may be representative of a position of a target being imaged/viewed with the portable imaging/viewing subsystem. The camera positioner may aim the camera toward the target in response to the signal. The target may, for example, be a man overboard. Thus, the system may be useful in search and rescue operations.

Abstract: In accordance with at least one embodiment of the present invention, a portable inspection system is disclosed to capture inspection data, such as for example an infrared image, sound information, and/or electrical measurement information. The inspection data may be securely recorded (e.g., with an encryption algorithm) along with associated information, which may include for example date, time, system settings, operator identification, and location.

Abstract: A microbolometer circuit includes, in accordance with an embodiment, a first microbolometer and a bias circuit, coupled to the first microbolometer, configured to provide a bias current to the first microbolometer to provide a first output signal based on a resistance of the first microbolometer. An output circuit, coupled to the bias circuit and the first microbolometer, is configured to provide an output signal based on the first output signal, wherein the bias circuit or the output circuit or both are configured to provide a varying signal level to compensate the first output signal for a change in the resistance of the first microbolometer due to the bias current increasing a temperature of the first microbolometer.

Abstract: Systems and methods disclosed herein provide for various embodiments of maritime control components. For example in one embodiment, a control component, adapted to be used with a watercraft, includes a mounting feature adapted to mount the control component to a steering wheel of the watercraft, and a mode selector of the control component adapted to receive and transmit a first user input signal corresponding to a user selected mode of operation from a plurality of selectable modes of operation including a map mode, a sonar mode, a fishfinder mode, a radar mode, an autopilot pattern mode, an entertainment mode, and/or a maritime mode. The control component further includes an increase/decrease actuator adapted to receive and transmit a second user input signal corresponding to a user selection within the user selected mode of operation. Embodiments of a watercraft and a method of display control are also provided.

Abstract: Various techniques are provided for performing detection using a focal plane array (FPA). For example, in one embodiment, a unit cell of an FPA may be implemented to support rapid sampling in response to one or more laser pulses reflected from an object or feature of interest. An FPA implemented with such unit cells may be used, for example, in an imaging system capable of detecting a plurality of two dimensional image frames and providing a three dimensional image using the detected two dimensional image frames. Other applications of such rapid sampling unit cells are also contemplated.

Abstract: Systems and methods are disclosed herein to provide improved infrared camera techniques for vehicular applications. For example, in accordance with an embodiment of the present invention, a vehicle includes at least a first plate to reflect infrared energy and an infrared camera to detect the infrared energy reflected from the first plate(s) to provide infrared images. The plate allows the infrared camera to provide a desired line of sight view without requiring the infrared camera to be directly within the line of sight.

Abstract: In accordance with at least one embodiment of the present invention, a portable inspection system is disclosed to capture inspection data, such as for example an infrared image, sound information, and/or electrical measurement information. The inspection data may be securely recorded (e.g., with an encryption algorithm) along with associated information, which may include for example date, time, system settings, operator identification, and location.

Abstract: Systems and methods disclosed herein provide for infrared camera systems and methods for dual sensor applications. For example, in one embodiment, an enhanced vision system comprises an image capture component having a visible light sensor to capture visible light images and an infrared sensor to capture infrared images. The system comprises a first control component adapted to provide a plurality of selectable processing modes to a user, receive a user input corresponding to a user selected processing mode, and generate a control signal indicative of the user selected processing mode, wherein the plurality of selectable processing modes includes a visible light only mode, infrared only mode, and a combined visible-infrared mode.

Abstract: Systems and methods are disclosed herein to provide die identification. For example, in accordance with an embodiment of the present invention, a wafer patterning technique is disclosed that provides multiple-exposure patterning to provide a unique identifying mark for each die on a wafer.

Abstract: Systems and methods are disclosed herein, as an example, to provide microbolometer resonant cavity tuning techniques and calibration techniques in accordance with one or more embodiments of the present invention. For example, in accordance with one embodiment, a method of operating an array of microbolometers on a substrate of an infrared camera system includes filtering infrared radiation to pass a first infrared radiation wavelength and to block a second infrared radiation wavelength, wherein the first infrared radiation wavelength is different than the second infrared radiation wavelength; setting a spacing between the microbolometers and the substrate to approximately tune the microbolometers to the second infrared radiation wavelength which is blocked by the filtering; and determining calibration data for the microbolometers.

Abstract: An infrared camera, in accordance with one embodiment, includes a housing having disposed therein one or more heating elements; a vent; a sensor for detecting a humidity level and providing a sensor signal indicating the humidity level within the housing; and a logic circuit configured to receive the sensor signal and determine if the humidity level within the housing should be reduced, wherein the logic circuit provides a control signal to switch on at least one of the heating elements if the humidity level should be reduced via the vent.

Abstract: In a microbolometer detector the individual transducers in the focal plane array are support by leg members that are attached to the underlying readout integrated circuit (ROIC) chip at locations underneath transducers other than transducer which they support. A variety of configurations are possible. For example, the leg members may be attached to the ROIC chip at locations under adjacent transducers on opposite sides or on the same side of the supported transducer, or at locations underneath transducers that are not immediately adjacent to the supported transducer. In this way the effective length of the leg members and therefore the thermal isolation of the transducer they support can be increased.

Abstract: In a microbolometer detector the individual transducers in the focal plane array are support by leg members that are attached to the underlying readout integrated circuit (ROIC) chip at locations underneath transducers other than transducer which they support. A variety of configurations are possible. For example, the leg members may be attached to the ROIC chip at locations under adjacent transducers on opposite sides or on the same side of the supported transducer, or at locations underneath transducers that are not immediately adjacent to the supported transducer. In this way the effective length of the leg members and therefore the thermal isolation of the transducer they support can be increased.

Abstract: Analog signal voltages are updated sequentially in a first sample-and-hold circuit, while an emitter element displays a pixel of a first display frame in response to a stored analog signal voltage in an isolated parallel second sample-and-hold circuit. After all unit cells are updated, the switches are reversed for the two parallel sample-and-hold circuits, displaying a pixel of a second display frame in response to an updated stored analog signal voltage in the first sample-and-hold circuit. The operation of the two parallel circuits alternates for each sequential frame. A constant current source in the unit cell provides constant power dissipation and temperature, independent from variations in emitter element current, up to a predetermined constant current limit. For emitter element currents greater than the predetermined limit, an independent current source in the unit cell is automatically activated without involving external control logic.

Abstract: A differential current mode amplifier circuit (5,5′) includes a first circuit leg having a first current source providing a current I1 coupled in series with a first transistor (m1) at a first circuit node (n1). The first transistor has a control terminal for coupling to an input signal potential (Vs). Vs is obtained from a unit cell of a radiation detector array, and is indicative of a magnitude of an integrated, photon-induced charge. The first circuit leg outputs a first output current (Is). A second circuit leg includes a second current source providing a current I2 coupled in series with a second transistor (m2) at a second circuit node (n2). The second transistor has a control terminal for coupling to an input reference potential (Vr). The second circuit leg outputs a second output current (Ir). A resistance (Rs) is coupled between the first circuit leg and the second circuit leg at the first circuit node and the second node.

Abstract: A method and related system provides an array of sensing elements located in rows and columns, and each column of sensing elements has a connected circuit chain which processes the signals from the sensing elements in that column. Each circuit chain produces a signal with a corrective gain value calculated for it relative to the datum of the array which is selected for the point where signal strength would be strongest. The method and device is capable of being used in a starring or scanning type array mode.

Abstract: A charge transfer structure (30) includes a substrate comprised of semiconductor material and, coupled to a surface of the substrate, a plurality of serially coupled devices each having a gate terminal. The plurality of serially coupled devices include a first single port device (D1) defining a first primary charge storage well, a second single port device (D3) defining a second primary charge storage well, a first two port device (D2) defining a first transfer device, a second two port device (D4) defining a second transfer device, and two instances of a third two port device each defining a cascode device (CD). The ports of these devices are serially coupled together in an order given by D1, D2, CD, D3, D4, CD for transferring charge between the first and second primary charge storage wells. Charge is inserted into and withdrawn from each of the first and second primary charge storage wells through a single diffusion that functions as both an input port and an output port.

Abstract: Correction for temperature-induced non-uniformities in the response characteristics of the microbolometers in an infrared focal plane array (FPA) is performed by applying a non-uniform corrective bias to the individual microbolometers. The corrective bias is applied either before or during the bias or integration period during which the detectors are sampled. The bias-correction can be applied to two-dimensional detector multiplexers at each column amplifier input, the reference potential for each column amplifier or the voltage supply for each detector element. The magnitude of each corrective bias is determined by calibrating the detectors at different temperatures and different levels of incident infrared radiation. According to another aspect of this invention, a microbolometer which is thermally-shorted to the substrate on which the read out integrated circuit (ROIC) is formed is used along with the sensing microbolometer to compensate for variations in temperature.

Abstract: An IR focal plane array (IR-FPA) includes an IR radiation detector (11a) having a plurality of IR radiation responsive photodetectors (PDs) and a readout integrated circuit (11) that includes a plurality of unit cells arranged in an N.times.M matrix. Each unit cell has an input coupled to an output of one of the IR radiation responsive photodetectors. The IR-FPA further includes M column amplifiers, preferably CTIAs, individual ones of which have an input that is coupled through one of N switches (.phi.tr) to individual ones of the N unit cells. A charge integrating capacitance in each unit cell is formed by a charge well underlying one (.phi..sub.1) of a plurality of transfer gates coupled between individual ones of the N unit cells that are coupled to one of the M column amplifiers.

Abstract: Correction for temperature-induced non-uniformities in the response characteristics of the microbolometers in an infrared focal plane array (FPA) is performed by applying a non-uniform corrective bias to the individual microbolometers. The corrective bias is applied either before or during the bias or integration period during which the detectors are sampled. The bias-correction can be applied to two-dimensional detector multiplexers at each column amplifier input, the reference potential for each column amplifier or the voltage supply for each detector element. The magnitude of each corrective bias is determined by calibrating the detectors at different temperatures and different levels of incident infrared radiation. According to another aspect of this invention, a microbolometer which is thermally-shorted to the substrate on which the read out integrated circuit (ROIC) is formed is used along with the sensing microbolometer to compensate for variations in temperature.