Patents by Inventor James Taoka

James Taoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heating Configuration for Use in Thermal Processing Chambers
    Publication number: 20070297775
    Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.
    Type: Application
    Filed: September 11, 2007
    Publication date: December 27, 2007
    Inventors: Zion Koren, Conor O'Carroll, Shuen Choy, Paul Timans, Rudy Santo Cardema, James Taoka, Arieh Strod
  • Heating configuration for use in thermal processing chambers
    Publication number: 20050213949
    Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.
    Type: Application
    Filed: May 19, 2005
    Publication date: September 29, 2005
    Inventors: Zion Koren, Conor O'Carroll, Shuen Choy, Paul Timans, Rudy Cardema, James Taoka, Arieh Strod
  • Apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold body
    Patent number: 5730803
    Abstract: The present invention discloses an apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold plate. Further, the overall structure of the electrostatic chuck in combination with the heat transfer apparatus of the present invention permits the thermal and pressure isolation of the high-temperature, vacuum process chamber containing the work piece processing surface of the electrostatic chuck from the low-temperature, atmospheric pressured heat transfer apparatus of the present invention.
    Type: Grant
    Filed: February 23, 1996
    Date of Patent: March 24, 1998
    Assignee: Applied Materials, Inc.
    Inventors: Robert Steger, James Taoka, Gregory Shmunis