Patents by Inventor James Tjan-Meng Suminto

James Tjan-Meng Suminto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8146436
    Abstract: A pressure transducer is provided that has a transducer body with a rim, a diaphragm that deflects in response to pressure and a sensor bonded to the diaphragm at the rim and at a center of the diaphragm. The sensor detects deflection of the metal diaphragm. The sensor and diaphragm are made of different materials. A thermal expansion difference between the sensor and the diaphragm is accommodated by flexures in the sensor that accept relative motion in a radial direction of the metal diaphragm with little effect on a sensitivity of the silicon structure to motion in an axial direction of the diaphragm.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: April 3, 2012
    Assignee: Meggitt (San Juan Capistrano), Inc.
    Inventors: James Tjan-Meng Suminto, Leslie Bruce Wilner
  • Publication number: 20090139338
    Abstract: A pressure transducer is provided that has a transducer body with a rim, a diaphragm that deflects in response to pressure and a sensor bonded to the diaphragm at the rim and at a center of the diaphragm. The sensor detects deflection of the metal diaphragm. The sensor and diaphragm are made of different materials. A thermal expansion difference between the sensor and the diaphragm is accommodated by flexures in the sensor that accept relative motion in a radial direction of the metal diaphragm with little effect on a sensitivity of the silicon structure to motion in an axial direction of the diaphragm.
    Type: Application
    Filed: September 29, 2008
    Publication date: June 4, 2009
    Inventors: James Tjan-Meng Suminto, Leslie Bruce Wilner
  • Patent number: 6670538
    Abstract: A radiation sensor which includes a thermopile for detecting radiant energy. The thermopile and a support rim for the thermopile are fabricated as an integrated unit to form a support chip. The support chip is mated to a mating chip so that the thermopile is positioned in an inner cavity region of the radiation sensor. The sensor has a window which permits the transmission of radiant energy into the enclosure such that the radiant energy impinges upon a central absorber region of the thermopile.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: December 30, 2003
    Assignee: Endevco Corporation
    Inventors: Leslie Bruce Wilner, Andrew J. Meyer, James Tjan-Meng Suminto, Joseph Salvatore Fragala
  • Publication number: 20020139410
    Abstract: A radiation sensor which includes a thermopile for detecting radiant energy. The thermopile and a support rim for the thermopile are fabricated as an integrated unit to form a support chip. The support chip is mated to a mating chip so that the thermopile is positioned in an inner cavity region of the radiation sensor. The sensor has a window which permits the transmission of radiant energy into the enclosure such that the radiant energy impinges upon a central absorber region of the thermopile.
    Type: Application
    Filed: January 2, 2002
    Publication date: October 3, 2002
    Applicant: Endevco Corporation
    Inventors: Leslie Bruce Wilner, Andrew J. Meyer, James Tjan-Meng Suminto, Joseph Salvatore Fragala