Abstract: A hydrosilylation process is used to prepare a clustered functional polyorganosiloxane. The clustered functional polyorganosiloxane comprises a reaction product of a reaction of a) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more radical curable groups selected from an acrylate group and a methacrylate group; in the presence of d) a hydrosilylation catalyst, and e) an isomer reducing agent. The weight percent of silicon bonded hydrogen atoms in component b) divided by the weight percent of aliphatically unsaturated organic groups in component a) (the SiHb/Via ratio) ranges from 4/1 to 20/1. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

Abstract: An alkoxy-functional organopolysiloxane resin and polymer is disclosed that comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin comprising R3SiO1/2 units and SiO4/2 units; (ii) an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom at a molecular terminal; (iii) an endcapper according to the formula to the formula R23Si—(R22SiO)s—SiR22H or R23Si—(R22SiO)t—(HR2SiO)—SiR23, or combinations thereof; and (iv) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups in the presence of a (v) hydrosilylation catalyst. In this alkoxy-functional organopolysiloxane resin and polymer, each R2 is independently a hydrocarbon radical and the subscripts s and t independently have values ranging from 0 to 10.

Abstract: A curable silicone composition is provided that comprises a reaction product of a reaction of (I) a clustered functional polyorganopolysiloxane having at least one radical curable group selected from an acrylate group and a methacrylate group; (II) a silicone reactive diluent, and a (III) a radical initiator.

Abstract: A control apparatus is provided that can provide high dynamic resolution and is suitable for inclusion within an integrated circuit. The control apparatus receives a demand signal representing a desired value of a measurand, and a feedback signal representing a present value or a recently acquired value of the measurand. The processing circuit forms a further signal a further signal which is a function of the demand and feedback signals. The further signal is then subjected to at least an integrating function. The demand signal, feedback signal or the further signal is processed or acquired in a sampled manner. The use of such sampled, i.e. discontinuous, processing allows integration time constants to be synthesized which would otherwise require the use of unfeasibly large components within an integrated circuit, or the use of off-chop components. Both of these other options are expensive.

Abstract: A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane-functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.

Abstract: A hydrosilylation process is used to prepare a polyorganosiloxane having clustered functional groups at the polyorganosiloxane chain terminals. The ingredients used in the process include a) a polyorganosiloxane having an average of at least 2 aliphatically unsaturated organic groups per molecule, b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule and at least 4 silicon bonded hydrogen atoms for each aliphatically unsaturated organic group in ingredient a), c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more curable groups; and d) a hydrosilylation catalyst. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

Abstract: An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups; in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst. The method further comprises blending the thermally conductive clustered functional polymer with a radical initiator.

Abstract: A silicone composition contains I) a shrink additive and II) a curable polyorganosiloxane composition. A method for fabricating an electronic device includes the steps of: 1) interposing the silicone composition between an IHS and a substrate, 2) curing the curable polyorganosiloxane composition to form a cured silicone product, and 3) removing the shrink additive during and/or after step 2), thereby compressing the IHS to the substrate. Compressing occurs as thickness of the cured silicone product decreases, as compared to thickness of the silicone composition interposed in step 1).

Abstract: A composition is capable of curing via condensation reaction. The composition uses a new condensation reaction catalyst. The new condensation reaction catalyst is used to replace conventional tin catalysts. The composition can react to form a gum, gel, rubber, or resin.

Abstract: Filled silicone composition, in situ preparation and use thereof are provided. The composition comprises a mixture of (A) an in situ-prepared treated silica, (B) an in situ-prepared (siloxane-alkylene)-endblocked polydiorganosiloxane, (c) a cure catalyst and (D) a crosslinker. Moreover, the composition can be used as adhesive, coating and sealant.

Abstract: A composition is capable of curing via condensation reaction. The composition uses a new condensation reaction catalyst. The new condensation reaction catalyst is used to replace conventional tin catalysts. The composition can react to form a gum, gel, rubber, or resin.

Abstract: A curable silicone composition is provided that comprises a reaction product of a reaction of (I) a clustered functional polyorganopolysiloxane having at least one radical curable group selected from an acrylate group and a methacrylate group; (II) a silicone reactive diluent, and a (III) a radical initiator.

Abstract: A hydrosilylation process is used to prepare a clustered functional polyorganosiloxane. The clustered functional polyorganosiloxane comprises a reaction product of a reaction of a) a polyorganosiloxane having an average, per molecule, of at least 2 ahphatically unsaturated organic groups; b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more radical curable groups selected from an acrylate group and a methacrylate group; in the presence of d) a hydrosilylation catalyst, and e) an isomer reducing agent. The weight percent of silicon bonded hydrogen atoms in component b) divided by the weight percent of aliphatically unsaturated organic groups in component a) (the SiHb/Via ratio) ranges from 4/1 to 20/1. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

Abstract: An alkoxy-functional organopolysiloxane resin and polymer is disclosed that comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin comprising R3SiO1/2 units and SiO4/2 units; (ii) an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom at a molecular terminal; (iii) an endcapper according to the formula to the formula R23Si—(R22SiO)s—SiR22H or R23Si—(R22SiO)t—(HR2SiO)—SiR23, or combinations thereof; and (iv) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups in the presence of a (v) hydrosilylation catalyst. In this alkoxy-functional organopolysiloxane resin and polymer, each R2 is independently a hydrocarbon radical and the subscripts s and t independently have values ranging from 0 to 10.

Abstract: A composition is capable of curing via condensation reaction. The composition uses a new condensation reaction catalyst. The new condensation reaction catalyst is used to replace conventional tin catalysts. The composition can react to form a gum, gel, rubber, or resin.

Abstract: A moisture-curable silicone adhesive composition is provided that comprises (A) a reactive resin, (B) a reactive polymer, (C) a moisture cure catalyst, and (D) a crosslinker resin. The reactive resin (A) comprises the reaction product of a reaction of an alkenyl-functional siloxane resin comprising R3SiO1/2 units and SiO4/2 units and an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom in the presence of a hydrosilylation catalyst. The reactive polymer (B) comprises the reaction product of a reaction of an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom and a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups in the presence of a hydrosilylation catalyst.

Abstract: A method for forming a thermally conductive thermal radical cure silicone composition comprising (I) a clustered functional polyorganopolysiloxane; optionally (II) a silicone reactive diluent, (III) a filler comprising a thermally conductive filler, (III?) a filler treating agent, and (IV) a radical initiator is provided. In this method, the clustered functional polyorganosiloxane (I) and the optional silicone reactive diluent (II) are premade prior to their addition to respective components (III), (III?) and (IV).

Abstract: A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane-functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.

Abstract: An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups; in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst. The method further comprises blending the thermally conductive clustered functional polymer with a radical initiator.

Abstract: A composition is capable of curing via condensation reaction. The composition uses a new condensation reaction catalyst. The new condensation reaction catalyst is used to replace conventional tin catalysts. The composition can react to form a gum, gel, rubber, or resin.