Abstract: A testing system for use in measuring thermal properties of material is described herein. The testing system includes a testing apparatus and monitoring system coupled to the testing apparatus. The testing apparatus includes a housing assembly that is configured to receive a material. A heating assembly is coupled to the housing assembly to supply a heat to at least a portion of the material to increase the temperature of the material. A sensing assembly is coupled to the housing assembly and is configured to sense a temperature of the material. The monitoring system comprises a controller having a processor comprising computer-readable instructions for operating the heating assembly to apply a heat to the material volume, receiving signals from the sensing assembly indicative of a temperature of the material, and estimating at least one thermal property of the material utilizing the sensed temperature of the material volume.

Abstract: A testing system for use in measuring thermal properties of material is described herein. The testing system includes a testing apparatus and monitoring system coupled to the testing apparatus. The testing apparatus includes a housing assembly that is configured to receive a material. A heating assembly is coupled to the housing assembly to supply a heat to at least a portion of the material to increase the temperature of the material. A sensing assembly is coupled to the housing assembly and is configured to sense a temperature of the material. The monitoring system comprises a controller having a processor comprising computer-readable instructions for operating the heating assembly to apply a heat to the material volume, receiving signals from the sensing assembly indicative of a temperature of the material, and estimating at least one thermal property of the material utilizing the sensed temperature of the material volume.

Abstract: Novel structures are provided including laminated layers of the diamond film in different patterns for conducting, generating and/or absorbing thermal energy. In particular, a thermal sensor/heater is shown including a doped electrically conductive diamond film layer encapsulated by layers of undoped electrically insulative layers on a silicon wafer. Also, a GaAs/Si on diamond laminate structure is provided in which the diamond film acts as a substrate and a heat sink. Notably, the diamond film structures are characterized by their high thermal conductivity, high chemical resistance, and high hardness/wear resistance due to the properties of the diamond films.