Patents by Inventor James V. Hause

James V. Hause has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a bonding pad structure
    Patent number: 5436197
    Abstract: A test card (10) or a semiconductor die (150) having bonding pads (41-43, 180-182) for testing semiconductor devices, and a method for making the bonding pads (41-43, 180-182) are shown. The test card (10) or the semiconductor die (150) is partitioned into a plurality of bonding pad regions (14-17 and 170-173). Bonding pads (41-43, 180-182) are formed in the respective bonding pad regions (14-17 and 170-173). The bonding pad regions (14-17 and 170-173) and the bonding pads (41-43, 180-182) are formed by patterning a layer of conductive material (16, 167) on a major surface (12) of the test card (10) or on the semiconductor die (150).
    Type: Grant
    Filed: September 7, 1993
    Date of Patent: July 25, 1995
    Assignee: Motorola, Inc.
    Inventor: James V. Hause