Abstract: Provided is an electrodepositable coating composition of a resinous phase dispersed in an aqueous medium, the resinous phase including (a) an active hydrogen-containing, cationic salt group-containing resin; and (b) an at least partially blocked polyisocyanate curing agent. The composition contains an organotin catalyst which is or is derived from a dialkyltin compound having the structure (I): [R1][R2]—Sn?O??(I) where R1 and R2 are the same or different, and each independently represents a monovalent hydrocarbon group wherein the sum of the carbon atoms in R1 and R2 is greater than 8. The catalyst is present in an amount sufficient to effect cure at a temperature at or below 340° F. (171.1° C.). Methods of preparing and using the composition also are provided.

Abstract: Provided is an electrodepositable coating composition of a resinous phase dispersed in an aqueous medium, the resinous phase including (a) an active hydrogen-containing, cationic salt group-containing resin; and (b) an at least partially blocked polyisocyanate curing agent. The composition contains an organotin catalyst which is or is derived from a dialkyltin compound having the structure (I): [R1][R2]—Sn?O??(I) where R1 and R2 are the same or different, and each independently represents a monovalent hydrocarbon group wherein the sum of the carbon atoms in R1 and R2 is greater than 8. The catalyst is present in an amount sufficient to effect cure at a temperature at or below 340° F. (171.1° C.). Methods of preparing and using the composition also are provided.

Abstract: A curable coating composition is disclosed comprising a resinous binder comprising (a) a reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups, the reaction product having reactive functional groups, and (b) a curing agent having functional groups reactive with the functional groups of (a). An electroconductive pigment is dispersed in (a) such that the weight ratio of the electroconductive pigment to (a) plus (b) is within the range of 0.5 to 9.0:1. When the curable coating composition is deposited and cured on a metal substrate, the cured coating is weldable.

Abstract: A curable coating composition is disclosed comprising a resinous binder comprising (a) a reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups, the reaction product having reactive functional groups, and (b) a curing agent having functional groups reactive with the functional groups of (a). An electroconductive pigment is dispersed in (a) such that the weight ratio of the electroconductive pigment to (a) plus (b) is within the range of 0.5 to 9.0:1. When the curable coating composition is deposited and cured on a metal substrate, the cured coating is weldable.

Abstract: A curable coating composition is disclosed comprising a resinous binder comprising (a) a reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups, the reaction product having reactive functional groups, and (b) a curing agent having functional groups reactive with the functional groups of (a). An electroconductive pigment is dispersed in (a) such that the weight ratio of the electroconductive pigment to (a) plus (b) is within the range of 0.5 to 9.0:1. When the curable coating composition is deposited and cured on a metal substrate, the cured coating is weldable.

Abstract: A curable coating composition is disclosed comprising a resinous binder comprising (a) a reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups, the reaction product having reactive functional groups, and (b) a curing agent having functional groups reactive with the functional groups of (a). An electroconductive pigment is dispersed in (a) such that the weight ratio of the electroconductive pigment to (a) plus (b) is within the range of 0.5 to 9.0:1. When the curable coating composition is deposited and cured on a metal substrate, the cured coating is weldable.

Abstract: An electrodeposition process is provided for applying an elastomeric thermosetting, film-forming polymer to a corrosion-resistant electrically conductive substrate that is free of an electrodeposited coating. The elastomeric polymer typically is a polyurethane, a polyurea or a poly(urethane urea). The film-forming coating applied by this process provides chip resistance to the substrate. A coated article that is prepared according to the process is also provided.

Abstract: A tamper evident closure including a threaded cap for a threaded container neck and an enclosing cap mounted on the threaded cap. The threaded cap is provided with indicia which is permanently visible through a transparent portion or aperture in the enclosing cap after the closure is removed from the container.