Abstract: Novel methods for providing asperities (sometimes referred to as asperates) on interposer contacts. The asperities comprise low electrical resistant particles such as titanium carbide that are bonded or plated in conjunction with nickel or other matrices on metallic substrate pads. An electroplating bath that has the low electrical resistant particles dispersed in solution is used at low current densities to electrolytically plate a composite electrically low resistant abrasive surface. The composite bond between the particles and the substrate can then be further reinforced with a standard metallic electroplate, if desired.

Abstract: The invention pertains to a method for fluorometrically monitoring a Clean-In-Place (“CIP”) system and for fluorometrically monitoring the dosage of chemical added to the CIP system. Monitoring of the said CIP system can be based upon fluormetrically monitoring the fluorescent tracer, chemical or both, which are added to the CIP system.