Patents by Inventor James Vickers
James Vickers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11962822Abstract: A system, method and data structure for processing basic client application data types to add thereto extension types and priority levels adapted for use by each of a plurality of set top box classes.Type: GrantFiled: November 5, 2019Date of Patent: April 16, 2024Assignee: Comcast Cable Communications Management, LLCInventors: James Hindle, Peter G. N. Scheyen, Mark A. Vickers
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System and method of preparing integrated circuits for backside probing using charged particle beams
Patent number: 11605525Abstract: Described herein are a system and method of preparing integrated circuits (ICs) so that the ICs remain electrically active and can have their active circuitry probed for diagnostic and characterization purposes using charged particle beams. The system employs an infrared camera capable of looking through the silicon substrate of the ICs to image electrical circuits therein, a focused ion beam system that can both image the IC and selectively remove substrate material from the IC, a scanning electron microscope that can both image structures on the IC and measure voltage contrast signals from active circuits on the IC, and a means of extracting heat generated by the active IC. The method uses the system to identify the region of the IC to be probed, and to selectively remove all substrate material over the region to be probed using ion bombardment, and further identifies endpoint detection means of milling to the required depth so as to observe electrical states and waveforms on the active IC.Type: GrantFiled: December 10, 2020Date of Patent: March 14, 2023Assignee: FEI CompanyInventors: James Vickers, Seema Somani, Cecelia Campochiaro, Yakov Bobrov -
System and method of preparing integrated circuits for backside probing using charged particle beams
Publication number: 20210098228Abstract: Described herein are a system and method of preparing integrated circuits (ICs) so that the ICs remain electrically active and can have their active circuitry probed for diagnostic and characterization purposes using charged particle beams. The system employs an infrared camera capable of looking through the silicon substrate of the ICs to image electrical circuits therein, a focused ion beam system that can both image the IC and selectively remove substrate material from the IC, a scanning electron microscope that can both image structures on the IC and measure voltage contrast signals from active circuits on the IC, and a means of extracting heat generated by the active IC. The method uses the system to identify the region of the IC to be probed, and to selectively remove all substrate material over the region to be probed using ion bombardment, and further identifies endpoint detection means of milling to the required depth so as to observe electrical states and waveforms on the active IC.Type: ApplicationFiled: December 10, 2020Publication date: April 1, 2021Inventors: James VICKERS, Seema SOMANI, Cecelia CAMPOCHIARO, Yakov BOBROV -
System and method of preparing integrated circuits for backside probing using charged particle beams
Publication number: 20190287762Abstract: Described herein are a system and method of preparing integrated circuits (ICs) so that the ICs remain electrically active and can have their active circuitry probed for diagnostic and characterization purposes using charged particle beams. The system employs an infrared camera capable of looking through the silicon substrate of the ICs to image electrical circuits therein, a focused ion beam system that can both image the IC and selectively remove substrate material from the IC, a scanning electron microscope that can both image structures on the IC and measure voltage contrast signals from active circuits on the IC, and a means of extracting heat generated by the active IC. The method uses the system to identify the region of the IC to be probed, and to selectively remove all substrate material over the region to be probed using ion bombardment, and further identifies endpoint detection means of milling to the required depth so as to observe electrical states and waveforms on the active IC.Type: ApplicationFiled: January 22, 2019Publication date: September 19, 2019Inventors: James VICKERS, Seema SOMANI, Cecelia CAMPOCHIARO, Yakov BOBROV -
System and method of preparing integrated circuits for backside probing using charged particle beams
Publication number: 20190227119Abstract: Described herein are a system and method of preparing integrated circuits (ICs) so that the ICs remain electrically active and can have their active circuitry probed for diagnostic and characterization purposes using charged particle beams. The system employs an infrared camera capable of looking through the silicon substrate of the ICs to image electrical circuits therein, a focused ion beam system that can both image the IC and selectively remove substrate material from the IC, a scanning electron microscope that can both image structures on the IC and measure voltage contrast signals from active circuits on the IC, and a means of extracting heat generated by the active IC. The method uses the system to identify the region of the IC to be probed, and to selectively remove all substrate material over the region to be probed using ion bombardment, and further identifies endpoint detection means of milling to the required depth so as to observe electrical states and waveforms on the active IC.Type: ApplicationFiled: January 22, 2019Publication date: July 25, 2019Inventors: James VICKERS, Seema SOMANI, Cecelia CAMPOCHIARO, Yakov BOBROV -
Patent number: 8459703Abstract: A pawl assembly that can be installed to the output shaft of a latch mechanism more easily, and in some embodiments without the use of tools, as compared to prior art pawls.Type: GrantFiled: April 11, 2006Date of Patent: June 11, 2013Assignee: Southco, Inc.Inventors: Glenn E. Anderson, Richard E. Schlack, D. Dale Turner, James Vickers, Stephen K. Spatig, Richard B. Langkamp, H. Allen Riblett
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Patent number: 7829566Abstract: Quinazolines of the formula I in which R, R1, R2, R3, R4 and Y have the meaning indicated in Patent Claim 1, and their salts or solvates as glycoprotein IbIX antagonists.Type: GrantFiled: December 14, 2005Date of Patent: November 9, 2010Inventors: Werner Mederski, Ralf Devant, Gerhard Barnickel, Sabine Bernotat-Danielowski, James Vickers, Bertram Cezanne, Daljit Dhanoa, Bao-Ping Zhao, James Rinker, Mark R. Player, Edward Jaeger, Richard Soll
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Publication number: 20090267360Abstract: The present invention is directed to a pawl assembly that can be installed to the output shaft of a latch mechanism more easily, and in some embodiments without the use of tools, as compared to prior art pawls.Type: ApplicationFiled: April 11, 2006Publication date: October 29, 2009Applicant: SOUTHCO, INC.Inventors: Glenn E. Anderson, Richard E. Schlack, D. Dale Turner, James Vickers, Stephen K. Spatig, Richard B. Langkamp, H. Allen Riblett
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Patent number: 7547702Abstract: Quinazolines of the formula (I) in which R, R1, R2, R3, R4 and Y have the meaning indicated in Patent claim 1, and their salts or solvates as glycoprotein 1bIX antagonists.Type: GrantFiled: September 17, 2001Date of Patent: June 16, 2009Assignee: Ortho-McNeil Pharmaceutical, Inc.Inventors: Werner Mederski, Maria Devant, legal representative, Gerhard Barnickel, Sabine Bernotat-Danielowski, James Vickers, Bertram Cezanne, Daljit Dhanoa, Bao-Ping Zhao, James Rinker, Mark R. Player, Edward Jaegar, Richard Soll, Ralf Devant
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Publication number: 20080100319Abstract: The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performance parameter is known to be indicative of a particular fabrication process in the fabrication. Evaluation information may then be obtained based on a variance of the value of the performance parameter at the plurality of locations. This may be done without affecting a usability of a chip that is created from the die. The evaluation information may be used to evaluate how one or more processes that include the particular fabrication process that was indicated by the performance parameter value was performed.Type: ApplicationFiled: November 5, 2007Publication date: May 1, 2008Inventors: Majid Aghababazadeh, Jose Estabil, Nader Pakdaman, Gary Steinbrueck, James Vickers
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Publication number: 20070293667Abstract: Quinazolines of the formula I in which R, R1, R2, R3, R4 and Y have the meaning indicated in Patent Claim 1, and their salts or solvates as glycoprotein IbIX antagonists.Type: ApplicationFiled: December 14, 2005Publication date: December 20, 2007Inventors: Werner Mederski, Ralf Devant, Gerhard Barnickel, Sabine Bernotat-Danielowski, James Vickers, Bertram Cezanne, Daljit Dhanoa, Bao-Ping Zhao, James Rinker, Mark Player, Edward Jaeger, Richard Soll
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Publication number: 20070236232Abstract: The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performance parameter is known to be indicative of a particular fabrication process in the fabrication. Evaluation information may then be obtained based on a variance of the value of the performance parameter at the plurality of locations. This may be done without affecting a usability of a chip that is created from the die. The evaluation information may be used to evaluate how one or more processes that include the particular fabrication process that was indicated by the performance parameter value was performed.Type: ApplicationFiled: June 14, 2007Publication date: October 11, 2007Inventors: Majid Aghababazadeh, Jose Estabil, Nader Pakdaman, Gary Steinbrueck, James Vickers
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Publication number: 20070238206Abstract: The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performance parameter is known to be indicative of a particular fabrication process in the fabrication. Evaluation information may then be obtained based on a variance of the value of the performance parameter at the plurality of locations. This may be done without affecting a usability of a chip that is created from the die. The evaluation information may be used to evaluate how one or more processes that include the particular fabrication process that was indicated by the performance parameter value was performed.Type: ApplicationFiled: June 14, 2007Publication date: October 11, 2007Inventors: Majid Aghababazadeh, Jose Estabil, Nader Pakdaman, Gary Steinbrueck, James Vickers
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Publication number: 20070205608Abstract: The present invention is directed to a latching system that includes a latch assembly, a cup, and a keeper plate. The latch assembly includes a base, a lever, and a catch. The lever is pivotally connected to the base and the catch is pivotally connected to the lever. The base is pivotally attached to the cup such that it rotates about an axis of rotation that is perpendicular in direction in relation to the direction of the axis of rotation of the lever relative to the base. The keeper plate includes a keeper projection. The lever can be lifted and the latch assembly rotated about the axis of rotation of the base to clear the keeper from the catch and thereby allow the opening of a first closure member relative to a second closure member.Type: ApplicationFiled: February 16, 2007Publication date: September 6, 2007Applicant: SOUTHCO, INC.Inventors: James Vickers, Ian White, David White, Joshua Baker
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Publication number: 20070205795Abstract: A bi-convex solid immersion lens is disclosed, having a top and bottom convex surfaces. The radius of curvature of the bottom surface is larger than that of the top surface. A conical sloped side-wall connects the top and bottom surface.Type: ApplicationFiled: May 8, 2007Publication date: September 6, 2007Applicant: CREDENCE SYSTEMS CORPORATIONInventors: Nader PAKDAMAN, James Vickers
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Publication number: 20070206846Abstract: A system for probe-less non-invasive detection of electrical signals from integrated circuit devices is disclosed. The system includes an illumination source, collection optics, imaging optics, and a photon sensor. In a navigation mode, the light source is activated and the imaging optics is used to identify the target area on the chip and appropriately position the collection optics. Once the collection optics is appropriately positioned, the light source is deactivated and the photon sensor is used to detect photons emitted from the chip. No mention of cooling (active device measurement capability) and advanced optics to detect the features (SIL).Type: ApplicationFiled: May 8, 2007Publication date: September 6, 2007Applicant: CREDENCE SYSTEMS CORPORATIONInventors: Daniel COTTON, Nader PAKDAMAN, James VICKERS, Thomas WONG
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Publication number: 20070187679Abstract: The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performance parameter is known to be indicative of a particular fabrication process in the fabrication. Evaluation information may then be obtained based on a variance of the value of the performance parameter of the plurality of locations. This may be done without affecting a usability of a chip that is created from the die. The evaluation information may be used to evaluate how one or more processes that include the particular fabrication process that was indicated by the performance parameter value was performed.Type: ApplicationFiled: April 20, 2007Publication date: August 16, 2007Inventors: Majid Aghababazadeh, Jose Estabil, Nader Pakdaman, Gary Steinbrueck, James Vickers
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Publication number: 20070004063Abstract: The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performance parameter is known to be indicative of a particular fabrication process in the fabrication. Evaluation information may then be obtained based on a variance of the value of the performance parameter at the plurality of locations. This may be done without affecting a usability of a chip that is created from the die. The evaluation information may be used to evaluate how one or more processes that include the particular fabrication process that was indicated by the performance parameter value was performed.Type: ApplicationFiled: August 31, 2006Publication date: January 4, 2007Inventors: Majid Aghababazadeh, Jose Estabil, Nader Pakdaman, Gary Steinbrueck, James Vickers
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Publication number: 20060208503Abstract: A latch assembly for releasably securing a striker in a rotary pawl latch. The latch assembly includes a housing, a rotary pawl, and an actuator. The housing can have 5 one sidewall having a notch for receiving the striker. A trigger can be pivotally attached to the housing such that the actuator releases the rotary pawl thus opening the latch.Type: ApplicationFiled: February 27, 2006Publication date: September 21, 2006Inventors: Alan Simchayoff, Richard Langkamp, D. Dale Turner, James Vickers
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Publication number: 20060019974Abstract: Quinazolines of the formula (I) in which R, R1, R2, R3, R4 and Y have the meaning indicated in Patent claim 1, and their salts or solvates as glycoprotein IbIX antagonists.Type: ApplicationFiled: September 17, 2001Publication date: January 26, 2006Inventors: Werner Mederski, Ralf Devant, Maria Devant, Gerhard Barnickel, Sabine Bernotat-Danielowski, James Vickers, Bertram Cezanne, Daljit Dhanoa, Bao-Ping Zhao, James Rinker, Mark Player, Edward Jaeger, Richard Soll