Patents by Inventor James Vincent Hedin

James Vincent Hedin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6377725
    Abstract: An optical-interconnect arrangement is disclosed in various embodiments. In one embodiment, an optical-interconnect node includes a an optical-link section and a processor-link section. The optical-link section includes an optical combiner and an optical splitter. The combiner combines an optical signal of a local node with optical signals from other connected nodes, and the combined signals are carried on a common waveguide. Each node has an optical splitter that splits the optical signals for local processing. The processor-link section includes a demultiplexer and a transmitter. The optical signals from a splitter are input to a demultiplexer, which separates and converts the optical signals to respective electrical signals. The transmitter converts a local electrical signal to an optical signal having a wavelength associated with the node.
    Type: Grant
    Filed: April 10, 2000
    Date of Patent: April 23, 2002
    Assignee: Lockheed Martin Corporation
    Inventors: Rick C. Stevens, James Vincent Hedin