Abstract: A molded voltage sensor is provided that achieves excellent sensing accuracy over a wide temperature range by molding promary and secondary capacitances are of a voltage divider into a solid dielectric material and wherein th e capacitances are preferably fabricated from the same material, or at least materials having nearly identical temperature coefficients of permittivity. In a preferred arrangement, a first member of dielectric material includes a conductive pattern of the outer surface thereof and an electrical connection attached to the conductive pattern. The first memberis the molded into a prerdetermined location with respect to a central conductor and a layer of the dielectric molding material is also molded over the exterior of the first member. Another conductive pattern is formed on the over-molded layer. The overall assembly is then molded to form a body of the sesired shape and provides insulation between the conductor and the conductive patterns.

Abstract: A method and arrangement is provided to form a gas-tight joint between an end flange and a tubular rod. The joint is formed via a heat-shrink process to provide an interference fit. The rod is provided with grooves to retain adhesive during the assembly process.

Abstract: A method and arrangement is provided to form a gas-tight joint between an end flange and a tubular rod. The joint is formed via a heat-shrink process to provide an interference fit. The rod is provided with grooves to retain adhesive during the assembly process.

Abstract: A method and arrangement is provided to form a gas-tight joint between two housing portions, e.g. between an end flange and a tubular pole-unit housing for a circuit interrupter or an insulating support column. The joint is formed via a heat-shrink process to provide an interference fit. The housing is provided with grooves to retrain adhesive during the assembly process.

Abstract: An electrical path or interconnection arrangement is provided within a formed support body of polymeric material that exhibits volumetric changes during and after the forming thereof. The electrical path or interconnection arrangement provides an accurately positioned electrically conductive path through the material of the support body and also responds to, accommodates and alleviates the effects of forces at the interface between the material of the support body and the electrical path or interconnection arrangement that occur during and after the forming of the support body. The interconnection arrangement exhibits predetermined deformability/compressibility characteristics to alleviate stresses caused by the volumetric changes of the polymeric material. In a preferred arrangement, the interconnection arrangement includes an elongated tubular conductor fabricated from a metallic material.