Abstract: A connector mounting for an integrated circuit chip package having pad-type terminal contacts around its periphery, has a flat synthetic resin housing provided with a recess in its top side for receiving the chip package with its terminal contacts facing downwardly for electrical contact with laterally extending flexible spring contact arm portions of respective contact members mounted in the housing. An electrically conductive metal clamp or cover member is hingedly mounted on the housing to engage and press the chip package downwardly in the housing recess into contact member-engaging position therein. The contact members have rigid contact pin portions firmly anchored in the housing bottom and projecting perpendicularly downward therefrom in row alignment around the housing for plugging into a printed circuit board.