Abstract: A comparator circuit for use in a semiconductor test system for comparing differential output signals of a semiconductor device under test (DUT). The comparator circuit is formed of a first pair of comparators having a DC comparator and an AC comparator which receives a first differential signal, a second pair of comparators having a DC comparator and an AC comparator which receives a second differential signal, a first latch for latching output of the first pair of comparators, a second latch for latching output of the second pair of comparators, and first and second serial-parallel converters for converting output signals of the first and second latches into parallel signals. The comparator circuit is formed of discrete components on a dielectric substrate.

Abstract: A comparator circuit for use in a semiconductor test system for comparing differential output signals of a semiconductor device under test (DUT). The comparator circuit is formed of a first pair of comparators having a DC comparator and an AC comparator which receives a first differential signal, a second pair of comparators having a DC comparator and an AC comparator which receives a second differential signal, a first latch for latching output of the first pair of comparators, a second latch for latching output of the second pair of comparators, and first and second serial-parallel converters for converting output signals of the first and second latches into parallel signals. The comparator circuit is formed of discrete components on a dielectric substrate.

Abstract: A method for producing a contact structure having a contactor for achieving an electrical connection with a contact target. The method include the steps of providing a substrate, forming a polymer layer on a surface of the dielectric substrate, positioning a micromachining tool over the first abrasive layer and irradiating a beam of electro-thermal energy on a surface of the polymer layer to form a deposition pattern thereon, depositing conductive material in the deposition pattern on the polymer layer thereby forming a horizontal portion of the contactor, and repeating the above steps, thereby forming a contact portion of the contactor in a vertical direction on one end of the horizontal portion.

Abstract: A method of producing a contact structure for electrical communication with a contact target. The method includes the steps of providing a silicon substrate cut in a (100) crystal plane, applying a first photolithography process on an upper surface of the silicon substrate for forming an etch stop layer, forming a first insulation layer on the etch stop layer, forming a second insulation layer on a bottom surface of the silicon substrate, applying a second photolithography process on the second insulation layer for forming an etch window, performing an anisotropic etch on the silicon substrate through the etch window for forming a base portion of a contactor, depositing conductive material on the first insulation layer for forming a conductive layer in a beam shape projected from the base portion, and mounting a plurality of contactors produced in the foregoing steps on a contact substrate in predetermined diagonal directions.

Abstract: A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contact structure is formed of a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer formed on the silicon base and projected from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a contact beam is created by the insulation layer and the conductive layer. The contact beam exhibits a spring force in a transversal direction of the contact beam to establish a contact force when the tip of the beam portion pressed against a contact target.

Abstract: A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed of contact beams and a contact substrate. The contact beam is configured by a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer having a planar shape and formed on the silicon base and projected from the inclined support, and a conductive layer having a planar shape and made of conductive material formed on one surface of the insulation layer so that a beam portion is created by the insulation layer and the conductive layer. The insulation layer and the conductive layer have substantially the same length. The beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target.

Abstract: A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contact structure is formed of a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer formed on the silicon base and abutted from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a beam portion is created by the insulation layer and the conductive layer, where wherein the beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target.

Abstract: A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contact structure is formed of a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer formed on the silicon base and abutted from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a beam portion is created by the insulation layer and the conductive layer, where wherein the beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target.

Abstract: A contact structure for achieving an electrical connection with a contact target is formed by producing a contactor on a planar surface of a substrate by a microfabrication technology. The contact structure is comprised of a substrate having a planar surface, a groove formed on the substrate lower than the planar surface, and a contactor formed on the substrate. The contactor includes a horizontal portion which is a substantially straight beam with a fixed and a free end, and a contact portion mounted on the free end of the horizontal portion in a direction perpendicular to the horizontal portion. The fixed end is connected to the substrate and the free end is positioned over the groove on the substrate. The groove provides a free space for the contactor when it is pressed against the contact target such that the free end of the horizonal beam enters the groove.

Abstract: A production method for forming contact structures on a planar surface of a substrate and removing therefrom to mount the contact structures on a contact substrate. The contact structure is formed of a base beam which is attached to a surface of the contact substrate in a vertical direction, a horizontal beam which is connected to the base beam at one end, and a top beam formed on another end of the horizontal beam and is oriented in the vertical direction. The production method includes the steps of forming a sacrificial layer on a silicon substrate, forming, exposing and developing a photoresist layer, depositing conductive material on the photoresist layer to form the contact structures, and removing the photoresist layer and the sacrificial layer to separate the contact structures from the silicon substrate.

Abstract: A contact structure for achieving an electrical connection with a contact target is formed of a contact substrate and a plurality of contactors mounted on the contact substrate. The contactors are produced on a semiconductor substrate or other dielectric by a microfabrication technology. Each of the contactors has a contact bump to contact with the contact target. In one aspect, one of the base portions of the contactor is slidably formed on the surface of the contact substrate. A spring force is generated when the contactor is pressed against the contact target. Various types of contact structures and the associated production methods are also described.

Abstract: A contact structure for establishing electrical communication with contact targets with improved contact performance including frequency bandwidth, contact pitch, reliability and cost. The contact structure is formed of a plurality of finger like contactors mounted on a contact substrate. Each of the contactors includes a silicon base having an inclined support portion, an insulation layer formed on the silicon base and projected from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a beam portion is created by the insulation layer and the conductive layer, wherein the beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target. An adhesive is applied for bonding the contactors to the surface of the contact substrate.

Abstract: A method of producing a contact structure for achieving an electrical connection with a contact target. The contact structure includes a contactor formed on a planar surface of a substrate by a microfabrication technology. In one aspect, the production method involves a plastic molding technology. In another aspect, the production method involves a photolithography technology using a gray-tone photomask. The contactor has at least a horizontal portion formed on the substrate and a contact portion formed on one end of the horizontal portion. A spring force of the horizontal portion of the contactor provides a contact force when the contactor is pressed against the contact target. In a further aspect, the contact structure includes a recess for providing a free space for the contactor when the contactor is pressed against the contact target.

Abstract: A production method for forming contact structures on a planar surface of a substrate.