Abstract: A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.

Abstract: A method of making a circuitized substrate in which a commoning bar, used during the plating of the circuitry on the substrate and coupled to a second set of conductors which in turn are coupled to a first set of conductors, is terminated from the second set of conductors.

Abstract: A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.

Abstract: A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

Abstract: A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

Abstract: In a method for reducing sensed physical variables generating a plurality of control commands are generated at a control rate as a function of the sensed physical variables. An estimate of a relationship between the sensed physical variables and the control commands is also is used in generating the plurality of control commands. The estimate of the relationship is updated based upon a response by the sensed physical variables to the control commands. The generation of the control commands involves a quadratic dependency on the estimate of the relationship and the quadratic dependency is updated based on the update to the estimate.

Abstract: An information handling system (e.g., computer, server, etc.) Utilizing at least one circuitized substrate assembly of robust construction and possessing enhanced operational capabilities. The substrate assemblies include a substrate having at least one opening which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

Abstract: A method of controlling a multivariable system includes the step of receiving a plurality of sensor signals indicating current conditions of the system and receiving a plurality of commands. The desired dynamic response of the system is then determined based upon the commands and the sensor signals. The problem of controlling the system to achieve the desired dynamic response without violating numerous actuator and physical constraints is then formulated as a quadratic programming problem. By solving the quadratic programming problem, the effector commands are determined and the physical constraints are enforced.

Abstract: An information handling system (e.g., computer, server, etc.) Utilizing at least one circuitized substrate assembly of robust construction and possessing enhanced operational capabilities. The substrate assemblies include a substrate having at least one opening which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

Abstract: A method for forming a substructure or an electrical structure. To form the substructure, a sheet of conductive material having exposed first and second surfaces is provided. A hole is formed through the sheet of conductive material. A first layer of dielectric material is applied to the exposed first surface, after the forming the hole. No material was inserted into the hole before applying the first layer of dielectric material to the exposed first surface. To form the electrical structure, a multilayered laminate that includes a plurality of substructures is formed such that a dielectric layer insulatively separates each pair of successive substructures.

Abstract: An electronic card which includes a thin body portion, a storage device (e.g., semiconductor chip) and an antenna. In another embodiment, the card includes the body portion, the antenna, and a recording device (e.g., magnetic stripe).

Abstract: A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

Abstract: A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

Abstract: A printed circuit board for use in an electronic device package such as a ball grid array package or organic chip carrier package. This printed circuit board includes a glass-free dielectric for separating and insulating power cores, circuitry or plated through holes from each other to prevent shorts caused by a migration of conductive material along glass-based prepreg substrates.

Abstract: A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

Abstract: An information handling system (e.g., computer, server, etc.) Utilizing at least one circuitized substrate assembly of robust construction and possessing enhanced operational capabilities. The substrate assemblies include a substrate having at least one opening which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

Abstract: A method of controlling a multivariable system includes the step of receiving a plurality of sensor signals indicating current conditions of the system and receiving a plurality of commands. The desired dynamic response of the system is then determined based upon the commands and the sensor signals. The problem of controlling the system to achieve the desired dynamic response without violating numerous actuator and physical constraints is then formulated as a quadratic programming problem. By solving the quadratic programming problem, the effector commands are determined and the physical constraints are enforced.

Abstract: Real-time control of a dynamical system is provided by determining control variables that get as close as possible to producing a desired response. Additional consideration of physical limitations leads to a convex Quadratic Program with inequality constraints that needs to be solved in real-time. A new active set algorithm is described to solve the convex Quadratic Program efficiently that meets real-time requirements. Based on the key observation that the physical limitations of the system translate to optimal active sets that remain relatively unchanged over time (even though the actual optimal controls may be varying), starting guesses for the active set obtained from the final iterate in the previous time period greatly reduces the number of iterations and hence allows the Quadratic Programs to be solved to convergence in real-time.

Abstract: In a method for reducing sensed physical variables generating a plurality of control commands are generated at a control rate as a function of the sensed physical variables. An estimate of a relationship between the sensed physical variables and the control commands is also is used in generating the plurality of control commands. The estimate of the relationship is updated based upon a response by the sensed physical variables to the control commands. The generation of the control commands involves a quadratic dependency on the estimate of the relationship and the quadratic dependency is updated based on the update to the estimate.

Abstract: Providing a layer of ZnCr intermediate a dielectric substrate and a heat spreader enhances the adhesion between the dielectric substrate and heat spreader.