Abstract: Method and apparatus for heat transfer are described. In particular, a heat transfer device includes a housing having input and output ports for ingress and egress of a medium. The housing defines an interior volume with a first portion having pins extending therein and a second portion defined in part by a network of micro-channels. An interface between the first portion and the second portion of the interior volume has orifices for providing passageways for flow of the medium therebetween. A first portion of the pins are spaced apart from the interface to promote generation of vortices of the medium in the first portion of the interior volume.

Abstract: Airflow-based heat dissipation is described. A heat sink includes a housing with a first chamber and a second chamber separated by an interface located below the first chamber. The first chamber has sidewalls with first side ports and an access opening. Pins extend from a top surface of the interface into the first chamber. The top surface of the interface has dimples located between the pins and first passageways which extend from the dimples of the top surface to a bottom surface of the interface. The second chamber has a network of tunnels with ends that extend to the sidewalls to provide second side ports. The first passageways extend to the network of tunnels.