Patents by Inventor James W. Orband

James W. Orband has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for making circuitized substrates in a continuous manner
    Patent number: 7328502
    Abstract: Apparatus for making circuitized substrates using a continuous roll format in which layers of conductor and dielectric are fed into the apparatus, bonded, and passed on to other nearby work stations in which various processes such as hole formation, circuitization and, finally, segmentation occur. The resulting substrates can then be individually bonded to other, like substrates to form a larger multi-layered substrate with a plurality of conductive thru-holes, conductive and dielectric layers as part thereof.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: February 12, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: John M. Lauffer, Voya R. Markovich, James W. Orband, William E. Wilson
  • Apparatus and method for making circuitized substrates in a continuous manner
    Patent number: 7293355
    Abstract: Apparatus and method for making circuitized substrates using a continuous roll format in which layers of conductor and dielectric are fed into the apparatus, bonded, and passed on to other nearby work stations in which various processes such as hole formation, circuitization and, finally, segmentation occur. The resulting substrates can then be individually bonded to other, like substrates to form a larger multi-layered substrate with a plurality of conductive thru-holes, conductive and dielectric layers as part thereof.
    Type: Grant
    Filed: April 21, 2005
    Date of Patent: November 13, 2007
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: John M. Lauffer, Voya R. Markovich, James W. Orband, William E. Wilson