Patents by Inventor James W. Schultz

James W. Schultz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973270
    Abstract: Various examples are provided for flat lens antennas and their operation. In one example, among others, an antenna includes electrically thin (W<<?high), highly conducting, TEM mode antenna arms fed at a first end by a balun. The TEM mode antenna arms can be embedded in a spatially varied anisotropic dielectric material. A separation between the TEM mode antenna arms can increase from the first end to a second end where the TEM mode antenna arms transition to resistive card (Rcard) terminations when the TEM mode antenna arms are separated by a distance Hr, where a ratio of Hr to a height (H) of the antenna is in a range from about 0.2 to about 0.8.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: April 30, 2024
    Assignee: COMPASS TECHNOLOGY GROUP LLC
    Inventors: John W. Schultz, Brian L Petrie, Crystal L Bethards, James G. Maloney
  • Patent number: 6118356
    Abstract: A plurality of end caps engagable with a microwave cavity each have an underside configured differently to cause the microwave cavity to have different electrical responses depending on which end cap engages the microwave cavity. A microwave device includes a cylindrical cavity and an end cap movable within the cavity to change its axial position within the cavity thereby varying the volume and the electrical response of the cavity.
    Type: Grant
    Filed: September 16, 1998
    Date of Patent: September 12, 2000
    Assignee: Hughes Electronics Corporation
    Inventors: Keith N. Loi, Paul J. Tatomir, Franz D. Davis, Robert J. Ahulii, James W. Schultz
  • Patent number: 5839696
    Abstract: A modular payload structure providing standardized thermal, electrical and mechanical interfaces. The modular arrangement of the present invention has fixed radiator panels that have standard thermal and mechanical interfaces, allowing communication modules to "plug in" directly to the payload structure. In the case of high thermo-energy dissipating modules, heat pipes on the modules connect to the thermal interfaces and move energy from the modules to the thermal interfaces of the radiator panel.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: November 24, 1998
    Assignee: Hughes Electronics Corporation
    Inventors: Glenn Caplin, James W. Schultz, Romeo Santos, Jr., Gary M. York