Abstract: Base radios and communication apparatus (100) that include: a chassis (110); at least one power supply module (120) having a height that is substantially the height of a three rack unit chassis and having a width that is substantially one sixth the usable width of a nineteen inch rack; at least one fan kit module (130) having a first fan kit module dimension that is substantially the height of the power supply module and a second fan kit module dimension that is substantially five sixths the usable width of a nineteen inch rack; and at least one other module (140, 150) having a first module dimension that is substantially the second fan kit module dimension and having a corresponding second module dimension.

Abstract: Unheated external air is drawn into an electronic component housing (200). The external air is selectively heated to form heated air (209) and the extent of the heating is based at least in part upon the temperature within the electronic component housing (200). The heated air (209) or the unheated external air (206) is drawn across at least one electronic component (210) positioned within the electronic component housing (200). A first flow (222) of either the heated air or the unheated external air is selectively exhausted from the electronic component housing (200). A first amount of the first flow (222) is based at least in part upon the temperature within the electronic component housing. A second flow (216) of either the heated air or the unheated external air is selectively re-circulated within the housing. A second amount of the second flow (216) is based at least in part upon the temperature within the housing (200).

Abstract: A connector opening cover is used with an electronic system such as a base radio system. The cover includes a rigid portion having a plurality of openings formed therethrough; and a flexible portion attached to the rigid portion and having a plurality of corresponding removable portions that are located adjacent the plurality of openings, wherein each of at least a subset of the plurality of openings and the corresponding adjacent removable portions have dimensions that correspond to dimensions of a different connector for an electronic system, such that removing the corresponding removable portion allows insertion of the corresponding connector through the cover.

Abstract: A heat sink and component support assembly that includes a core structure (110). The core structure (110) includes: a central member (112) having first (114, 116) and second opposing sides; at least one heat dissipating surface (124, 126, 128) extending from at least one of the first opposing sides (114, 116); and first and second extension members (118, 120) positioned adjacent to each of the second opposing sides. The assembly may also include an airflow facilitating arrangement, such as a fan (184), positioned adjacent to the core structure (110) for further enhanced heat dissipating capabilities.

Abstract: An apparatus and method for releasable securement together of a transformer power supply assembly together which includes a stacked arrangement (20) of a first transformer core plate (28) positioned to overlie a circuit board (26), a second transformer core plate (24) positioned to underlie the first transformer core plate (28) and the circuit board (26) and a carrier member (22) positioned beneath the second transformer core plate (24), the first and second transformer core plates (28,24) contact one another through at least one opening positioned in the circuit board (26). The apparatus includes having a body positioned over the first transformer core plate (28) in which the body of the span member (32) extends over a surface of the first transformer core plate (28) and extends from a portion of a peripheral edge of the first transformer core plate (28) to another portion of the peripheral edge of the first transformer core plate (28).

Abstract: The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). The second layer (14) includes a first substrate. A fluid distributing manifold (28) is disposed proximate the first layer (12). A nozzle housing (30) having an aperture (36) is disposed in the first fluid distributing manifold (28).