Abstract: A process and apparatus are described for wire bonding circuit pads of large scale integrated design. The bonding process employs a capillary tool that applies heat and pressure to the wires in order to bond them to the circuit pad. The circuit pad is supported upon a closed woven, fiberglass mesh, which supports the circuit pad during the bonding process.

Abstract: A high density printed wiring board is prepared by applying an essentially solid material into plated through holes such that the metallized layers within the through hole are unaffected by chemical metal etchants. In this manner, lateral surface metallized layers can exclusively be reduced in thickness by use of said chemical agents. These thinned lateral surface metallized layers are ultimately converted into fine pitch, 25 to 40 microns, circuitry, thereby providing high density boards. Since the through hole wall metallization is unaffected by the etching process, excellent electrical connection between the fine line circuitry is obtained. Various printed wiring board embodiments are also presented.

Abstract: Apparatus is provided for coupling to a hand-held transceiver such as a cellular phone that is being operated in a radio frequency-shielded environment such as in an automobile, to transfer energy between the transceiver and an auxiliary antenna that is not shielded from the surroundings. The apparatus includes a pair of capacitor coupling elements (30, 32) that are positioned adjacent to each of the two radiating elements (40, 54) of the hand-held transceiver, and a coaxial cable (20) that connects the coupling elements to the auxiliary antenna. Each coupling element includes a sheet of electrically conductive material lying adjacent to a corresponding radiating element of the transceiver without surrounding the transceiver.

Abstract: A high density printed wiring board is prepared by applying an essentially solid material into plated through holes such that the metallized layers within the through hole are unaffected by chemical metal etchants. In this manner, lateral surface metallized layers can exclusively be reduced in thickness by use of said chemical agents. These thinned lateral surface metallized layers are ultimately converted into fine pitch, 25 to 40 microns, circuitry, thereby providing high density boards. Since the through hole wall metallization is unaffected by the etching process, excellent electrical connection between the fine line circuitry is obtained. Various printed wiring board embodiments are also presented.

Abstract: A process and apparatus are described for wire bonding circuit devices of large scale integrated design. The bonding process employs a capillary tool that applies heat and pressure to the wires in order to bond them to the circuit device. The circuit device, or pad, is supported upon a closed woven, fiberglass mesh, which supports the circuit device during the bonding process.

Abstract: A package for mounting an integrated circuit chip to a circuit board or the like is provided. The package includes a chip carrier which has a metal substrate including first and second opposed faces. A dielectric coating is provided on at least one of the faces, which preferably is less than about 20 microns in thickness, and preferably has a dielectric constant from about 3.5 to about 4.0. Electrical circuitry is disposed on the dielectric coating, said circuitry including chip mounting pads, connection pads and circuit traces connecting the chip mounting pads to the connection pads. An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon. In any case, the IC chip is electrically connected to the chip mounting pads either by the solder ball or wire bond connections.

Abstract: An antenna with loading coil is described, which has an especially high Q for longer range communication. The inside of the coil is left empty of solid material while a frame that surrounds the coil is of dielectric material. The wire that forms the coil is constructed so upper and lower wire portions that extend radially inwardly from the ends of the coil, extend at inclines much greater than the wind angle of the coil, and hold metallic coupling slugs away from the opposite ends of the coil. Strips of silicone extend between adjacent coil turns and are mounted on the coil, to minimize vibrations while using a minimum of dielectric material close to the coil. By combining these improvements into a practical commercial coil, applicant has raised the coil Q by 29.5% from the Q of his previous antenna which had the highest Q of citizen band antennas on the market.

Abstract: An assembly and process for connecting opposed semiconductor structures (12,14) comprising at least two structures. An interconnect (16) between the structures (12,14) connects the structures in opposed spaced relation to each other. The interconnect comprises a first material (18) and a second material (20). The first material comprises a resiliently flexible center portion. The second material comprises an electrically conductive outer portion surrounding the first material. The second material and the first material provide the interconnect with a flexibly compliant characteristic for maintaining an electrically conductive relationship between the structures.

Abstract: An antenna includes a dipole (20) with upper and lower elongated conductors (22, 24) and a feedline (40) for carrying radio frequency currents to the dipole by connecting the feedline to the lower end (30) of the upper conductor and to the upper end (32) of the lower conductor, which produces maximum gain. A spacer (50) spaces the center of the feedline by a distance (A) of about 3 centimeters from the center of the lower conductor, to produce minimum losses while providing a compact antenna. A toroidal ferrite core (110) lies at the bottom of the lower conductor and the feedline is in the form of a wire pair that is wrapped a plurality of times about the ferrite core to prevent signals radiated by the lower conductor and picked up by the feedline, from passing to the radio. A tuning member (150) of electrically conductive material can be slid along the spacer to tune the antenna without changing its height (B).

Abstract: A flexible interconnect for flexibly connecting an integrated circuit chip to a substrate. The flexible interconnect includes a flexible core, formed of a polymeric material, fully covered by a layer of an electrically conductive metal. A layer of a compliant material is provided beneath the input/output pad of the substrate and/or integrated circuit chip to reduce mechanical stresses on the flexible interconnect. The substrate and integrated circuit chip may include depressions to receive ends of the flexible interconnect. In one embodiment, the flexible interconnect may be tubular in shape and positioned on a protrusion formed on the substrate.

Abstract: An electronic package which includes a thermally conductive, e.g., copper, member having a thin layer of dielectric material, e.g., polyimide, on at least one surface thereof. On the polyimide is provided the desired high density circuit pattern which is electrically connected, e.g., using solder or wirebonds, to the respective contact sites of a semiconductor chip. If wirebonds are used, the copper member preferably includes an indentation therein and the chip is secured, e.g., using adhesive, within this indentation. If solder is used to couple the chip, a plurality of small diameter solder elements are connected to respective contact sites of the chip and to respective ones of the pads and/or lines of the provided circuit pattern. Significantly, the pattern possesses lines and/or pads in one portion which are of high density and lines and/or pads in another portion which are of lesser density.

Abstract: A thermally enhanced ball grid array package for electronic components, with an electronic and a plurality of ceramic component carriers bonded to a metal heat sink, enhances thermal performance, reduces solder ball fatigue and reduces stresses between the ceramic component carriers and the heat sink. Bonding the ceramic component carriers to the heat sink reduces expansion induced stresses of the solder balls on the carriers. Plural ceramic component carriers, smaller than a single carrier would have to be for the same package, reduce stresses at the interfaces between the ceramic component carriers and the heat sink.

Abstract: A semiconductor chip package and method of making same wherein the package comprises a ceramic substrate having two layers of thermally and electrically conductive material (e.g., copper) on opposing surfaces thereof, these layers thermally and electrically coupled by metal material located within holes provided in the ceramic. A semiconductor chip is mounted on one of these layers and the contact sites thereof electrically coupled to spaced circuitry which, in a preferred embodiment, is formed simultaneously with both thermally conductive layers. Coupling of the circuitry to an external substrate (e.g., printed circuit board) is preferably accomplished using metallic spring clips. These clips are preferably soldered in position. A preferred metal for being positioned within the hole(s) is solder, one example being 10:90 tin:lead solder.

Abstract: A transparent, flexible and deformable face shield that adaptably fits and conforms to the contours of the wearer's face to protect the wearer's eyes, contact lenses, face, etc. from hair spray products or other products containing contaminants. The face shield includes an inwardly projecting mouthpiece which is gripped between the wearer's teeth to hold the shield in sealing engagement over the wearer's face, leaving both of the wearer's hands free to perform hairstyling or other functions. The face shield may also include additional attachments for covering the forehead, ears or cheeks when the mask falls short of these areas.

Abstract: A transparent, flexible and deformable face shield that adaptably fits and conforms to the contours of the wearer's face to protect the wearer's eyes, contact lenses, face, etc. from hairspray products or other products containing contaminants. The face shield includes an inwardly projecting mouthpiece which is gripped between the wearer's teeth to hold the shield in sealing engagement over the wearer's face, leaving both of the wearer's hands free to perform hairstyling or other functions.

Abstract: A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 10,000 psi. As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.