Abstract: An improved security system is disclosed for material printed on a substrate comprising a primary marking printed on the substrate for conveying information. A secondary marking provides security to the primary marking. The secondary marking may include a variation in optical properties, a variation in magnetic properties or a variation in both in optical properties and magnetic properties of the primary marking. A method is disclosed comprising printing a primary and a secondary marking on a substrate with the primary marking conveying information and with the secondary marking providing security to the primary marking.

Abstract: The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.

Abstract: The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.

Abstract: The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host a transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.

Abstract: The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.

Abstract: An aesthetic, hangable ornament is produced by cutting a blank in the shape of, e.g. a bird or a butterfly from a laminate of three layers of vinyl, the outer two layers of which are holographic, cutting a hole in the blank, cutting slits in the blank to form a body including strips extending radially from a planar annulus around the hole to the periphery of the body, crimping the strips to incline them by 20-30° from the plane of the annulus, and mounting a multifaceted, polyhedral crystal in the hole using a hook, which is also used to suspend the ornament from a clear line.

Abstract: An aesthetic, hangable ornament is produced by cutting a blank in the shape of, e.g. a bird or a butterfly from a laminate of three layers of vinyl, the outer two layers of which are holographic, cutting a hole in the blank, cutting slits in the blank to form a body including strips extending radially from a planar annulus around the hole to the periphery of the body, crimping the strips to incline them by 20-30° from the plane of the annulus, and mounting a multifaceted, polyhedral crystal in the hole using a hook, which is also used to suspend the ornament from a clear line.

Abstract: A metalization layer formed as part of a bump connection/flip chip process for a semiconductor circuit is also used to form a sense resistor or other passive components. The metalization layers normal composition can also be altered so as to change or control the value of the so formed resistor or to improve the temperature stability of the resistor. Other passive components such as capacitors or inductor can also be formed in this layer.