Abstract: An electronic structure, and associated method of fabrication, that includes a substrate having attached circuit elements and conductive bonding pads of varying thickness. Pad categories relating to pad thickness include thick pads (17 to 50 microns), medium pads (10–17 microns), and thin pads (3 to 10 microns). A thick pad is used for coupling a ball grid array (BGA) to a substrate with attachment of the BGA to a circuit card. A medium pad is useful in flip-chip bonding of a chip to a substrate by use of an interfacing small solder ball. A thin copper pad, coated with a nickel-gold layer, is useful for coupling a chip to a substrate by use of a wirebond interface. The electrical structure includes an electrical coupling of two pads having different thickness, such that the pads are located either on the same surface of a substrate or on-opposite sides of a substrate.

Abstract: Foam bedding products including viscoelastic foam having a high airflow value that do not feel hot to the person sleeping on the products. One product is a pillow having a contoured core having sufficient firmness to provide effective support for a user and a hyper soft viscoelastic foam shell surrounding the core having sufficient firmness to maintain the appearance of a conventional pillow when supporting only a pillowcase or other bed coverings. The core may be made of higher density viscoelastic foam or of a resilient foam. Another product may be a mattress topper with or without foam cores for body support carried within slabs of high airflow viscoelastic foam.

Abstract: Disclosed herein is a locator system for a cutting device in combination with a production string. Where the production string has at least one detent along its circumference. The invention also comprises a lock formed to engage the detent, a cutting device, and a body on which the lock is attached. The body is connected to the cutting device such that when the lock is engaged to the detent, the cutting device is operatively connected to the detent and the cutting device is positioned at a location to accurately sever the production string at a desired depth. An alternative embodiment of the detent is a nipple profile and the production string comprises a series of tubing members connected end to end. The tubing members can be a completion tool, tubing, or a combination of both. Also disclosed is a method of using the locator system.

Abstract: Embedded flush circuitry features are provided by providing a conductive seed layer on the sidewalls and bottom of laser ablated trench features plating a layer of conductive metal onto the seed layer and depositing a layer of dielectric material.

Abstract: An electronic structure, and associated method of fabrication, that includes a substrate having attached circuit elements and conductive bonding pads of varying thickness. Pad categories relating to pad thickness include thick pads (17 to 50 microns), medium pads (10-17 microns), and thin pads (3 to 10 microns). A thick pad is used for coupling a ball grid array (BGA) to a substrate with attachment of the BGA to a circuit card. A medium pad is useful in flip-chip bonding of a chip to a substrate by use of an interfacing small solder ball. A thin copper pad, coated with a nickel-gold layer, is useful for coupling a chip to a substrate by use of a wirebond interface. The electrical structure includes an electrical coupling of two pads having different thickness, such that the pads are located either on the same surface of a substrate or on opposite sides of a substrate.

Abstract: In order to form a modular interface between a DUT board, which is housing devices under tests (DUT), to cables connected to a test head, a board spacer is provided that has an array of connectors. Each cable is connected to a respective connector, and the DUT board contains a corresponding array of connection points which are less than or equal to the number of connectors in the arrays on the board spacer. In this way, a common board spacer can be used to connect the cables to DUT boards housing different types of DUTs since the location of the connection points on the board spacer is known and kept constant. This interface allows a high speed and high fidelity connection between the test head and the devices on the DUTs for frequencies in excess of 50 MHz.

Abstract: A method for evaluating an input system interfacing a human user with an electronic device uses empirically determined bi-action times for users to perform a second input action (e.g., pressing a second key) immediately after performing a first input action (e.g., pressing a first key). The bi-action times (or, more generally, n-action times) are used together with a selected interface map which associates input actions (e.g., pressing keys) to corresponding signifiers (e.g., characters) to calculate a peak expert input rate for the input system. One or more optimized interface maps can be found by combining the evaluation method with any of various optimization strategies. For example, one method for optimizing the input system repeatedly changes the interface map and recalculates the peak expert input rate, while another optimization method calculates peak expert input rates for multiple interface maps in parallel.

Abstract: This invention is in the field of Chemical vapor infiltration and Chemical vapor deposition (CVI/CVD). More specifically, this invention is directed to method and apparatus for weighing parts being subjected to the CVI/CVD process, during the process itself to indicate a weight change thereof. The process may be terminated or altered as desired based upon the weight gain information.

Abstract: A process of fabricating a circuitized structure is provided. The process includes the steps of providing an organic substrate having circuitry thereon; applying a dielectric film on the organic substrate; forming microvias in the dielectric film; sputtering a metal seed layer on the dielectric film and the microvias; plating a metallic layer on the metal seed layer; and forming a circuit pattern thereon.

Abstract: Disclosed herein is a locator system for a cutting device in combination with a production string. Where the production string has at least one detent along its circumference. The invention also comprises a lock formed to engage the detent, a cutting device, and a body on which the lock is attached. The body is connected to the cutting device such that when the lock is engaged to the detent, the cutting device is operatively connected to the detent and the cutting device is positioned at a location to accurately sever the production string at a desired depth. An alternative embodiment of the detent is a nipple profile and the production string comprises a series of tubing members connected end to end. The tubing members can be a completion tool, tubing, or a combination of both. Also disclosed is a method of using the locator system.

Abstract: Embedded flush circuitry features are fabricated by providing a conductive seed layer on the sidewalls and bottom of laser ablated trench features plating a layer of conductive metal onto the seed layer and depositing a later of dielectric material.

Abstract: Embedded flush circuitry features are provided by providing a conductive seed layer on the sidewalls and bottom of laser ablated trench features plating a layer of conductive metal onto the seed layer and depositing a layer of dielectric material.

Abstract: A liner for a shaped charge formed from a mixture of powdered heavy metal and a powdered metal binder. The liner is formed by compression of the mixture into a liner body. In one embodiment of the invention, the mixture comprises a range of 50 to 93 percent by weight of tungsten, and 50 to 7 percent by weight of the powdered metal binder. In a specific embodiment of the invention, graphite powder is intermixed with the powdered metal binder to act as a lubricant during formation of the shaped charge liner. The powdered metal binder can be a combination of copper powder, lead, and molybdenum.

Abstract: A token is manufactured using a combination of minting or casting operations and printing operations. The token comprises a metal base material that is minted or cast to the size and shape desired including embossed or debossed areas at selected locations on the token. In selected recessed or countersunk portions of the token, there are provided thin disks of material capable of carrying printed material such as single-colored or multi-colored pictures or indicia. The imprinted disk portions of the token are covered with a first protective coating and, optionally a second protective coating, that eliminates wear and tear on the printed areas of the token. Additionally or alternatively, the entire token can be covered with an outer coating to minimize wear and tear and preserve the unique designs carried by the token.

Abstract: In order to form a modular interface between a DUT board, which is housing devices under tests (DUT), to cables connected to a test head, a board spacer is provided that has an array of connectors. Each cable is connected to a respective connector, and the DUT board contains a corresponding array of connection points which are less than or equal to the number of connectors in the arrays on the board spacer. In this way, a common board spacer can be used to connect the cables to DUT boards housing different types of DUTs since the location of the connection points on the board spacer is known and kept constant. This interface allows a high speed and high fidelity connection between the test head and the devices on the DUTs for frequencies in excess of 50 MHz.

Abstract: A token is manufactured using a combination of minting or casting operations and printing operations. The token comprises a metal base material that is minted or cast to the size and shape desired including embossed or debossed areas at selected locations on the token. In selected recessed or countersunk portions of the token, there are provided thin disks of material capable of carrying printed material such as single-colored or multi-colored pictures or indicia. The imprinted disk portions of the token are covered with a first protective coating and, optionally a second protective coating, that eliminates wear and tear on the printed areas of the token. Additionally or alternatively, the entire token can be covered with an outer coating to minimize wear and tear and preserve the unique designs carried by the token.

Abstract: In order to form a modular interface between a DUT board, which is housing devices under tests (DUT), to cables connected to a test head, a board spacer is provided that has an array of connectors. Each cable is connected to a respective connector, and the DUT board contains a corresponding array of connection points which are less than or equal to the number of connectors in the arrays on the board spacer. In this way, a common board spacer can be used to connect the cables to DUT boards housing different types of DUTs since the location of the connection points on the board spacer is known and kept constant. This interface allows a high speed and high fidelity connection between the test head and the devices on the DUTs for frequencies in excess of 50 MHz.

Abstract: A token is manufactured using a combination of minting or casting operations and printing operations. The token comprises a metal base material that is minted or cast to the size and shape desired including embossed or debossed areas at selected locations on the token. In selected recessed or countersunk portions of the token, there are provided thin disks of material capable of carrying printed material such as single-colored or multi-colored pictures or indicia. The imprinted disk portions of the token are covered with a first protective coating and, optionally a second protective coating, that eliminates wear and tear on the printed areas of the token. Additionally or alternatively, the entire token can be covered with an outer coating to minimize wear and tear and preserve the unique designs carried by the token.

Abstract: A liner for a shaped charge formed from a mixture of powdered heavy metal and a powdered metal binder. The liner is formed by compression of the mixture into a liner body. In one embodiment of the invention, the mixture comprises a range of 50 to 93 percent by weight of tungsten, and 50 to 7 percent by weight of the powdered metal binder. In a specific embodiment of the invention, graphite powder is intermixed with the powdered metal binder to act as a lubricant during formation of the shaped charge liner. The powdered metal binder can be a combination of copper powder, lead, and molybdenum.

Abstract: A liner for a shaped charge comprising powdered heavy metal tungsten coated with a metal binder coating compressively formed into a liner body. Each of the powdered heavy metal particles are substantially uniformly coated with metal binder coating. The preferred powdered heavy metal particles are comprised of tungsten. Optionally, the liner for a shaped charge includes a lubricant intermixed with the coated heavy metal particles. The metal binder coating is selected from the group consisting of copper, lead, nickel, tantalum, other malleable metals, and alloys thereof, and comprises from 40 percent to 3 percent by weight of the liner. The powdered heavy metal particles comprise from 60 percent to 97 percent by weight of the liner.