Abstract: A method is disclosed for fabricating a substantially planar photoimageable layer atop a first thin film member situated on a substrate. The substrate and first thin film member are covered with a first photoresist layer in one embodiment of the method. An asperity is formed in the first photoresist layer above the first thin film member. The remainder of the first photoresist layer outside of the asperity includes photoresist fields which are in the same plane as the first thin film member when viewed in cross section. The asperity is removed by photoimaging including masking, exposing and developing while the photoresist fields remain. A second photoresist layer is then applied to the resultant structure after the asperity is removed. The portions of the second photoresist layer atop the photoresist fields and the photoresist fields themselves are removed by photoimaging.

Abstract: A thin film magnetic head is fabricated on a substrate by depositing a seed layer on the substrate. This seed layer is advantageously used as a common seed for a plurality of magnetic head related structures which are built-up on the substrate. A lower magnetic layer is plated on the substrate in an opening provided in an insulative layer which is deposited on the substrate. The aforementioned seed layer is used as the seed for this lower magnetic layer. A plurality of magnetic layers are plated at one end of the lower magnetic layer to build-up and form a first side pole by using the above seed layer as a seed. Another plurality of magnetic layers are plated at the other end of the lower magnetic layer to build-up and form a second side pole by using the same seed layer as a seed. The first and second side poles thus formed include upper and lower ends, the lower ends being plated to the ends of the lower magnetic layer. A first upper pole is plated to the upper end of the first side pole.

Abstract: A method is provided for fabricating a thin film magnetic head on a substrate. A seed layer formed on the substrate and advantageously used as a common seed for a plurality of magnetic head related structures which are built-up on the substrate. A lower magnetic layer is plated on the substrate in an opening provided in an insulative layer which is deposited on the substrate. The aforementioned seed layer is used as the seed for the plating of this lower magnetic layer. A plurality of magnetic layers are plated at one end of the lower magnetic layer to build-up and form a first side pole by again using the aforementioned seed layer as a seed. Another plurality of magnetic layers are plated at the other end of the lower magnetic layer to build-up and form a second side pole by using the same seed layer as a seed. The first and second side poles thus formed include upper and lower ends, the lower ends being plated to the ends of the lower magnetic layer.

Abstract: A thin film magnetic head is fabricated on a substrate by depositing a lower shield layer on the substrate. A lower layer of a magnetic yoke is situated on the lower shield layer to couple the yoke to the shield. Alternatively, the magnetic yoke is isolated from the lower shield layer by an insulative layer therebetween. At the same time that first and second magnetic side poles are built up layer by layer via successive plating operations at the respective ends of a lower magnetic layer of the yoke, a side shield structure is plated up, layer by layer, at the periphery of the lower shield layer to surround resultant side pole structure. A shield cover is plated on the top of the side shield to substantially enclose the side pole structure, but leave an opening for an insulative pedestal though which the tops of the side poles extend. First and second magnetic poles are plated to the tops of the first and second side poles such that a gap region of non-magnetic material is formed therebetween.