Patents by Inventor James Welsh
James Welsh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12179037Abstract: Provided are methods for sequential radiotherapies, such as XRT. In some embodiments, a higher dosage of an XRT may first be administered to a subject, optionally in combination with an immunotherapy, and subsequently a lower dosage XRT is administered to the subject to treat a cancer. Separating the dosage and intensity of the radiotherapies can be used to achieve improved therapeutic responses, such as improved anti-cancer responses, survival times, and/or abscopal effects.Type: GrantFiled: December 9, 2019Date of Patent: December 31, 2024Assignee: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEMInventors: James Welsh, Maria Angelica Cortez, David Hong, Hampartsoum Berj Barsoumian
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Publication number: 20240289290Abstract: A Secure Enclave SiP (SE-SiP) is disclosed, which is an improvement to Trusted Platform Module (TPM) concepts, and in certain aspects, is a general-purpose next-generation security building block that provides all the security benefits of a system designed using a TPM, replaces the need to trust a general-purpose CPU chip vendor with the need to trust a much simpler more trustworthy configurable device, and replaces the need to trust the entire system motherboard manufacturer with the much more limited need to trust the SE-SiP manufacturer. It can provide privacy for the software and data sent to the system, resident on it, or retrieved from it, with respect to all parties-including the person/party in physical possession of the device.Type: ApplicationFiled: May 6, 2024Publication date: August 29, 2024Applicant: Octavo Systems LLCInventors: Peter Robert LINDER, Masood MURTUZA, Erik James WELSH, William Arthur Fitzhugh LEE
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Publication number: 20240266243Abstract: A unified design process for a System in a Package (SiP) device that includes optimizing desired thermal performance, including methods and structures for optimizing the thermal management of the SiP. A plurality of active components are separated by one or more thermal barriers. The proper thermal testing location may be indicated on a surface of the SiP packaging.Type: ApplicationFiled: May 31, 2022Publication date: August 8, 2024Applicant: OCTAVO SYSTEMS LLCInventors: Eshtaartha BASU, Erik James WELSH, Masood MURTUZA
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Patent number: 12001363Abstract: A Secure Enclave SiP (SE-SiP) is disclosed. The SE-SiP provides all the security benefits of a system designed using a Trusted Platform Module (TPM), replaces the need to trust a general-purpose CPU chip vendor with the need to trust a much simpler more trustworthy configurable device, and replaces the need to trust the entire system motherboard manufacturer with the much more limited need to trust the SE-SiP manufacturer. It can provide privacy for the software and data sent to the system, resident on it, or retrieved from it, with respect to all parties—including the person/party in physical possession of the device.Type: GrantFiled: May 21, 2021Date of Patent: June 4, 2024Assignee: OCTAVO SYSTEMS LLCInventors: Peter Robert Linder, Masood Murtuza, Erik James Welsh, William Arthur Fitzhugh Lee
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Patent number: 11965479Abstract: A rotor lock assembly for locking a rotor of a wind turbine. The rotor lock assembly has at least one relocatable rotor lock. The relocatable rotor lock has a housing, a bushing element, a pin shaft position within the bushing element, and a locking mechanism. The housing includes a mounting portion adapted for mounting to a bearing housing adjacent to a rotor lock plate of the rotor.Type: GrantFiled: March 17, 2021Date of Patent: April 23, 2024Assignee: GE Infrastructure Technology LLCInventors: Brian William Manikas, Paul Howard Davidson, Michael Frederick Sander, Jacob Thomas Hoyt, Jason James Welsh, Kevin L Holmes
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Publication number: 20230185748Abstract: A Secure Enclave SiP (SE-SiP) is disclosed. The SE-SiP provides all the security benefits of a system designed using a Trusted Platform Module (TPM), replaces the need to trust a general-purpose CPU chip vendor with the need to trust a much simpler more trustworthy configurable device, and replaces the need to trust the entire system motherboard manufacturer with the much more limited need to trust the SE-SiP manufacturer. It can provide privacy for the software and data sent to the system, resident on it, or retrieved from it, with respect to all parties—including the person/party in physical possession of the device.Type: ApplicationFiled: May 21, 2021Publication date: June 15, 2023Applicant: Octavo Systems LLCInventors: Peter Robert LINDER, Masood MURTUZA, Erik James WELSH, William Arthur Fitzhugh LEE
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Patent number: 11610844Abstract: High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.Type: GrantFiled: October 11, 2018Date of Patent: March 21, 2023Assignee: Octavo Systems LLCInventors: Gene Alan Frantz, Masood Murtuza, Erik James Welsh, Peter Robert Linder
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Patent number: 11502030Abstract: A substrate for a SIP is that has a portion of its top surface covered with spaced apart electrically conductive landing pads for electrical connection to components located on the surface and the landing pads serve as interconnection pads for making electrical connections between at least a portion of said pads when interconnected by a segment of bond wire to form at least a portion of the SIP. Methods for use of the universal substrate in SIP system design and manufacture of a SIP.Type: GrantFiled: August 31, 2017Date of Patent: November 15, 2022Assignee: OCTAVO SYSTEMS LLCInventors: Masood Murtuza, Erik James Welsh, Peter Linder, Gene Alan Frantz
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Patent number: 11373720Abstract: The present disclosure describes analog memories for use in a computer, such as a computer using a combination of analog and digital components/elements used in a cohesive manner.Type: GrantFiled: February 22, 2019Date of Patent: June 28, 2022Assignee: OCTAVO SYSTEMS LLCInventors: Peter Linder, Laurence Ray Simar, Jr., Erik James Welsh, Gene Alan Frantz
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Patent number: 11347478Abstract: The present disclosure describes a mixed signal arithmetic logic unit configured to use a combination of analog processing elements and digital processing elements in a cohesive manner. Depending on the signals and the data received for processing, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize computational results and the performance of the mixed signal arithmetic logic unit.Type: GrantFiled: February 22, 2019Date of Patent: May 31, 2022Assignee: OCTAVO SYSTEMS LLCInventors: Erik James Welsh, Laurence Ray Simar, Jr., Peter Linder, Gene Alan Frantz
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Publication number: 20220062655Abstract: Provided are methods for sequential radiotherapies, such as XRT. In some embodiments, a higher dosage of an XRT may first be administered to a subject, optionally in combination with an immunotherapy, and subsequently a lower dosage XRT is administered to the subject to treat a cancer. Separating the dosage and intensity of the radiotherapies can be used to achieve improved therapeutic responses, such as improved anti-cancer responses, survival times, and/or abscopal effects.Type: ApplicationFiled: December 9, 2019Publication date: March 3, 2022Applicant: Board of Regents, The University of Texas SystemInventors: James WELSH, Maria Angelica CORTEZ, David HONG, Hampartsoum Berj BARSOUMIAN
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Patent number: 11257803Abstract: A System in a Package (SiP) device is provided with an interconnect area or a physical space on a main SiP substrate that allows for a customizable second packaged component or device to be externally interconnected with the components on the main substrate of a packaged SiP to allow for modifications to the functionality of the components and devices on a primary (or main) SiP substrate.Type: GrantFiled: August 23, 2019Date of Patent: February 22, 2022Assignee: OCTAVO SYSTEMS LLCInventors: Masood Murtuza, Erik James Welsh, Christopher Lloyd Reinert, Gene Alan Frantz
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Publication number: 20220016205Abstract: Provided herein are methods of using BMP7 levels as a marker for the selection of patients, such as non-small cell lung cancer patients, who will clinically respond to combination therapy comprising a BMP7 inhibitor and an immune checkpoint therapy, such as an anti-PD1 therapy and/or an anti-CTLA-4 therapy. Also provided are methods of treating the selected patients with a combination of a BMP7 inhibitor and an immune checkpoint therapy.Type: ApplicationFiled: November 21, 2019Publication date: January 20, 2022Applicant: Board of Regents, The University of Texas SystemInventors: James WELSH, Maria Angelica CORTEZ
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Patent number: 11171651Abstract: The present disclosure describes a mixed signal computer unit using a combination of analog and digital components/elements in a cohesive manner. Depending on the signals and data that need to be processed, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize the computational results and the performance of the computation. Operations may be controlled by one or more digital cores.Type: GrantFiled: February 22, 2019Date of Patent: November 9, 2021Assignee: OCTAVO SYSTEMS LLCInventors: Laurence Ray Simar, Jr., Erik James Welsh, Peter Linder, Gene Alan Frantz
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Publication number: 20210222680Abstract: A rotor lock assembly for locking a rotor of a wind turbine. The rotor lock assembly has at least one relocatable rotor lock. The relocatable rotor lock has a housing, a bushing element, a pin shaft position within the bushing element, and a locking mechanism. The housing includes a mounting portion adapted for mounting to a bearing housing adjacent to a rotor lock plate of the rotor.Type: ApplicationFiled: March 17, 2021Publication date: July 22, 2021Inventors: Brian William Manikas, Paul Howard Davidson, Michael Frederick Sander, Jacob Thomas Hoyt, Jason James Welsh, Kevin L. Holmes
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Patent number: 11032910Abstract: Systems and methods for the design and use of a System-in-Package (SiP) device with a connection layout for minimizing a system Printed Circuit Board (PCB) using the SiP are provided.Type: GrantFiled: May 1, 2018Date of Patent: June 8, 2021Assignee: OCTAVO SYSTEMS LLCInventors: Erik James Welsh, Kevin Michael Troy
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Patent number: 10982655Abstract: A repair system for a gearbox of a wind turbine includes for removably coupling to the first portion of the gearbox housing of the gearbox. The lifting apparatus is adapted for lifting the first portion of the gearbox housing relative to the second portion gearbox housing. The repair system also includes at least one gearbox housing support member for mounting to the second portion of the gearbox housing. The at least one gearbox housing support member provides a support surface for the first portion of the gearbox housing during a repair procedure of the gearbox. The support surface is offset from the second portion of the gearbox housing.Type: GrantFiled: April 26, 2019Date of Patent: April 20, 2021Assignee: General Electric CompanyInventors: Brian William Manikas, Paul Howard Davidson, Michael Frederick Sander, Jacob Thomas Hoyt, Jason James Welsh, Kevin L. Holmes
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Publication number: 20210072958Abstract: The present disclosure describes a mixed signal arithmetic logic unit configured to use a combination of analog processing elements and digital processing elements in a cohesive manner. Depending on the signals and the data received for processing, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize computational results and the performance of the mixed signal arithmetic logic unit.Type: ApplicationFiled: February 22, 2019Publication date: March 11, 2021Applicant: Octavo Systems LLCInventors: Erik James WELSH, Laurence Ray SIMAR, Jr., Peter LINDER, Gene Alan FRANTZ
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Publication number: 20200403618Abstract: The present disclosure describes a mixed signal computer unit using a combination of analog and digital components/elements in a cohesive manner. Depending on the signals and data that need to be processed, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize the computational results and the performance of the computation. Operations may be controlled by one or more digital cores.Type: ApplicationFiled: February 22, 2019Publication date: December 24, 2020Applicant: Octavo Systems LLCInventors: Laurence Ray SIMAR, Jr., Erik James WELSH, Peter LINDER, Gene Alan FRANTZ
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Publication number: 20200402601Abstract: The present disclosure describes analog memories for use in a computer, such as a computer using a combination of analog and digital components/elements used in a cohesive manner.Type: ApplicationFiled: February 22, 2019Publication date: December 24, 2020Applicant: Octavo Systems LLCInventors: Peter LINDER, Laurence Ray SIMAR, Jr., Erik James WELSH, Gene Alan FRANTZ