Patents by Inventor James William Pruitt, II

James William Pruitt, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hardware packaging
    Patent number: 11390439
    Abstract: A hardware packaging assembly and method are provided. A hardware component has a front appearance surface and a back mounting surface. A package backing has a forward receiving surface to receive the back mounting surface of the hardware component. A retention feature protrudes from the package backing to engage the hardware component with an interference fit. The retention feature retains the hardware component on the package backing while maintaining the front appearance surface exposed.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: July 19, 2022
    Assignee: LIBERTY HARDWARE MFG. CORP.
    Inventors: James William Pruitt, II, Ryan Patrick Martin, James Leroy Daniels
  • HARDWARE PACKAGING
    Publication number: 20190009962
    Abstract: A hardware packaging assembly and method are provided. A hardware component has a front appearance surface and a back mounting surface. A package backing has a forward receiving surface to receive the back mounting surface of the hardware component. A retention feature protrudes from the package backing to engage the hardware component with an interference fit. The retention feature retains the hardware component on the package backing while maintaining the front appearance surface exposed.
    Type: Application
    Filed: July 6, 2018
    Publication date: January 10, 2019
    Applicant: LIBERTY HARDWARE MFG. CROP.
    Inventors: James William Pruitt, II, Ryan Patrick Martin, James Leroy Daniels