Patents by Inventor James Wilson Parker

James Wilson Parker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Waveguides to photodetector assembly
    Patent number: 6629784
    Abstract: An assembly for combining the outputs from a group of n single mode optical fibres on to the photosensitive surface of a photodetector (1) has an adiabatically tapered bundle (2) of fibres (3) the small end of which is fusion spliced to one end of a length (4) of multimode fibre whose other end is optically coupled with the detector (1) by means of a lens (5).
    Type: Grant
    Filed: June 30, 1998
    Date of Patent: October 7, 2003
    Assignee: Bookham Technology PLC
    Inventors: Terry Bricheno, James Wilson Parker
  • Telecommunications switches
    Patent number: 5986572
    Abstract: A telecommunications switch has a matrix architecture of n.times.m bus-interconnected, or space-switch interconnected, switch nodes together with additional switch nodes and n.times.m switch peripherals connected to the switch nodes externally of the bus (space-switch) interconnected switch node matrix. Fault protection redundancy is provided by providing each one of the peripherals with connections to two different switch nodes only one of which is enabled at any one time.
    Type: Grant
    Filed: April 19, 1996
    Date of Patent: November 16, 1999
    Assignee: Northern Telecom Limited
    Inventors: James Wilson Parker, Ernst August Munter
  • Crystal substrate processing
    Patent number: 5933707
    Abstract: This disclosure relates to the fabrication of components on a single crystal substrate. A method is disclosed of overcoming the problems encountered in defining etched features on a silicon substrate. In particular, there is disclosed a method of producing a multichip module comprising a silicon substrate having surface features for the placement of components. An organic dielectric is applied to the substrate prior to the use of an etchant whereby interconnects can be defined.
    Type: Grant
    Filed: March 7, 1996
    Date of Patent: August 3, 1999
    Assignee: Northern Telecom Limited
    Inventors: Peter John Ayliffe, James Wilson Parker, Paul Mark Harrison, Robert George Peall, Martin Christopher Geear, Roger William Harcourt