Abstract: An electronic device may have a housing. The device may include metal structures such as a metal member forming a portion of the housing, a portion of a strap, or other portions of the device. A gold-containing coating such as a layer of elemental gold or a gold alloy may cover the metal member to provide the metal member with a gold appearance or other desired appearance. To protect the metal member and the gold-containing coating, the metal member and gold-containing coating may be covered with a protective coating layer such as an organic protective layer. The organic protective layer may have a fluoropolymer layer with thiol coupling groups to promote adhesion to the gold-containing layer or may contain a polymer layer with silane and thiol coupling groups that serves as an adhesion promotion layer for an overlapping fluoropolymer layer with silane coupling groups.

Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.

Abstract: A glass fastening system includes a glass portion, a support structure defining a recess, a first adhesive layer disposed on an exterior surface of the glass portion facing the recess in the support structure, a second adhesive layer disposed within the recess of the support structure, and a fastener having a first portion secured to the first adhesive layer and a second portion extending away from the first portion and into the second adhesive layer to secure the glass portion to the support structure.

Abstract: A chemical treatment process has been identified as a simple and effective means of improving the bonding of injection-molded polymer to titanium surfaces. This process forms an oxide layer on a titanium surface that includes a layered double hydroxide. The layered double hydroxide both raises the bond strength and minimizes air or water leakage. The process enables the use of titanium alloys with injection molded polymer structural bonds in strong, lightweight, and water-resistant enclosures for consumer electronics.

Abstract: A method of and system for electrolytic production of reactive metals is presented. The method includes providing a molten oxide electrolytic cell including a container, an anode, and a current collector and disposing a molten oxide electrolyte within the container and in ion conducting contact with the anode and the current collector. The electrolyte includes a mixture of at least one alkaline earth oxide and at least one rare earth oxide. The method also includes providing a metal oxide feedstock including at least one target metal species into the molten oxide electrolyte and applying a current between the anode and the current collector, thereby reducing the target metal species to form at least one molten target metal in the container.

Abstract: A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.

Abstract: The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.

Abstract: A component for an electronic device can include a metal injection molded (MIM) metallic body that at least partially defines an exterior surface. The metallic body can have an average porosity less than 1% in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average porosity greater than 1% in a second region adjacent to the first region.

Abstract: A method of forming a part can include selectively activating one or more lasers of a laser array comprising at least 100 lasers based at least partially on a geometry of the part being formed. The method can further include scanning laser spots over a powder bed, the laser sports generated by the activated lasers, and selectively sintering a powder contained in the powder bed with the laser spots to form the part.

Abstract: A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.

Abstract: An electronic device may have a housing. The device may include metal structures such as a metal member forming a portion of the housing, a portion of a strap, or other portions of the device. A gold-containing coating such as a layer of elemental gold or a gold alloy may cover the metal member to provide the metal member with a gold appearance or other desired appearance. To protect the metal member and the gold-containing coating, the metal member and gold-containing coating may be covered with a protective coating layer such as an organic protective layer. The organic protective layer may have a fluoropolymer layer with thiol coupling groups to promote adhesion to the gold-containing layer or may contain a polymer layer with silane and thiol coupling groups that serves as an adhesion promotion layer for an overlapping fluoropolymer layer with silane coupling groups.

Abstract: An electronic device such as a wristwatch may include a conductive housing. A corrosion-resistant coating may be deposited on the conductive housing. The coating may include transition layers and an uppermost alloy layer. The transition layers may include a chromium seed layer on the conductive housing and a chromium nitride layer on the chromium seed layer. The uppermost alloy layer may include TiCrCN or other alloys and may provide the coating with desired optical reflection and absorption characteristics. The transition layers may include a minimal number of coating defects, thereby eliminating potential sites at which visible defects could form when exposed to salt water. This may allow the electronic device to exhibit a desired color and to be submerged in salt water without producing undesirable visible defects on the conductive housing structures.

Abstract: A glass sealing system includes a glass portion and a first adhesive layer disposed along an exterior surface of the glass portion. The glass sealing system also includes a cover with a first surface secured to the first adhesive layer and a second surface opposing the first surface. The glass sealing system includes a second adhesive layer disposed on the second surface and configured to secure the cover to a support structure. The cover obscures the second adhesive layer from view of a user looking through the glass portion toward the support structure.

Abstract: An electronic device such as a wristwatch may include a conductive housing. A corrosion-resistant coating may be deposited on the conductive housing. The coating may include transition layers and an uppermost alloy layer. The transition layers may include a chromium seed layer on the conductive housing and a chromium nitride layer on the chromium seed layer. The uppermost alloy layer may include TiCrCN or other alloys and may provide the coating with desired optical reflection and absorption characteristics. The transition layers may include a minimal number of coating defects, thereby eliminating potential sites at which visible defects could form when exposed to salt water. This may allow the electronic device to exhibit a desired color and to be submerged in salt water without producing undesirable visible defects on the conductive housing structures.

Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.

Abstract: A housing for an electronic device can include a metallic component at least partially defining an external surface of the device. The metallic component can have an average grain size less than 45 nanometers in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average grain size greater than 45 nanometers in a second region adjacent to the first surface.

Abstract: The disclosure is directed to aluminum alloys made from recycled components. The alloys have copper (Cu) from 0.051 to 0.10 wt %, chromium (Cr) from 0.01 to 0.10 wt %, zinc (Zn) from 0.02 to 0.20 wt %, manganese (Mn) from 0.03 to 0.10 wt %, iron (Fe) in an amount of at least 0.10 wt %, silicon (Si) in an amount of at least 0.35 wt %, magnesium (Mg) in amount of at least 0.45 wt %, and the remaining wt % being Al and incidental impurities. In other aspects, the disclosure is directed to aluminum alloys having copper (Cu) from 0.010 to 0.050 wt %, chromium (Cr) from 0.01 to 0.10 wt %, zinc (Zn) from 0.01 to 0.20 wt %, manganese (Mn) from 0.03 to 0.10 wt %, iron (Fe) in an amount of at least 0.10 wt %, silicon (Si) in an amount of at least 0.35 wt %, magnesium (Mg) in amount of at least 0.45 wt %, and the remaining wt % being Al and incidental impurities. The b* color of the alloys ranges from ?2 to 2, and the L* color ranges from 70 to 100.

Abstract: A counter gravity casting apparatus includes a reusable metal mold having a plurality of mold cavities, a feed tube configured to feed molten alloy into the mold, and a vacuum fitting configured to permit a vacuum to be applied to the mold. The mold includes multiple metal sections configured such that adjacent metal sections mate to one another, the metal sections being separable from one another. The metal sections include recesses that form the mold cavities, and the mold includes a sprue and multiple runner passages. The sprue is configured to receive molten alloy from the feed tube, and the multiple runner passages are configured to feed molten alloy from the sprue to the mold cavities. Methods of casting bulk amorphous alloy articles or feedstock is described.

Abstract: The disclosure provides a method of hardening an Fe-based alloy. The method may include cold rolling the Fe-based alloy to form a cold rolled alloy. The method may also include heating the cold rolled alloy to an elevated temperature in a nitrogen-containing gas to form a nitrided hardened Fe-based alloy. The nitrided hardened Fe-based alloy comprises N from 0.035 to 2.0 wt %.

Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.