Patents by Inventor James Zaccardi
James Zaccardi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7939928Abstract: A semiconductor package has a substrate with a plurality of contact pads. A first semiconductor die is mounted to the substrate. First bond wires are formed between each of the center-row contact pads of the first semiconductor die and the substrate contact pads. The first bond wires include an electrically insulative coating formed over the shaft that covers a portion of a surface of a bumped end of the first bond wires. An epoxy material is deposited over the first semiconductor die. A second semiconductor die is mounted to the epoxy material. Second bond wires are formed between each of the center-row contact pads of the second semiconductor die and the substrate contact pads. The second bond wires include an electrically insulative coating formed over the shaft of the second bond wires that covers a portion of a surface of a bumped end of the second bond wires.Type: GrantFiled: March 25, 2010Date of Patent: May 10, 2011Assignee: Microsemi CorporationInventor: James Zaccardi
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Publication number: 20100176501Abstract: A semiconductor package has a substrate with a plurality of contact pads. A first semiconductor die is mounted to the substrate. First bond wires are formed between each of the center-row contact pads of the first semiconductor die and the substrate contact pads. The first bond wires include an electrically insulative coating formed over the shaft that covers a portion of a surface of a bumped end of the first bond wires. An epoxy material is deposited over the first semiconductor die. A second semiconductor die is mounted to the epoxy material. Second bond wires are formed between each of the center-row contact pads of the second semiconductor die and the substrate contact pads. The second bond wires include an electrically insulative coating formed over the shaft of the second bond wires that covers a portion of a surface of a bumped end of the second bond wires.Type: ApplicationFiled: March 25, 2010Publication date: July 15, 2010Applicant: WHITE ELECTRONIC DESIGNS CORPORATIONInventor: James Zaccardi
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Patent number: 7718471Abstract: A semiconductor package has a substrate with a plurality of contact pads. A first semiconductor die is mounted to the substrate. First wire bonds are formed between each of the center-row contact pads of the first semiconductor die and the substrate contact pads. The first wire bonds include an electrically insulative coating formed over the shaft that covers a portion of a surface of a bumped end of the first wire bonds. An epoxy material is deposited over the first semiconductor die. A second semiconductor die is mounted to the epoxy material. Second wire bonds are formed between each of the center-row contact pads of the second semiconductor die and the substrate contact pads. The second wire bonds include an electrically insulative coating formed over the shaft of the second wire bonds that covers a portion of a surface of a bumped end of the second wire bonds.Type: GrantFiled: November 12, 2008Date of Patent: May 18, 2010Assignee: White Electronic Designs CorporationInventor: James Zaccardi
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Publication number: 20100117243Abstract: A semiconductor package has a substrate with a plurality of contact pads. A first semiconductor die is mounted to the substrate. First wire bonds are formed between each of the center-row contact pads of the first semiconductor die and the substrate contact pads. The first wire bonds include an electrically insulative coating formed over the shaft that covers a portion of a surface of a bumped end of the first wire bonds. An epoxy material is deposited over the first semiconductor die. A second semiconductor die is mounted to the epoxy material. Second wire bonds are formed between each of the center-row contact pads of the second semiconductor die and the substrate contact pads. The second wire bonds include an electrically insulative coating formed over the shaft of the second wire bonds that covers a portion of a surface of a bumped end of the second wire bonds.Type: ApplicationFiled: November 12, 2008Publication date: May 13, 2010Applicant: WHITE ELECTRONIC DESIGNS CORPORATIONInventor: James Zaccardi
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Patent number: 6938338Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.Type: GrantFiled: April 17, 2003Date of Patent: September 6, 2005Assignee: Tessera, Inc.Inventors: Joseph Fjelstad, John W. Smith, Thomas H. DiStefano, James Zaccardi, A. Christian Walton
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Publication number: 20030192181Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.Type: ApplicationFiled: April 17, 2003Publication date: October 16, 2003Inventors: Joseph Fjelstad, John W. Smith, Thomas H. DiStefano, James Zaccardi, A. Christian Walton
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Publication number: 20020008966Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.Type: ApplicationFiled: January 2, 2001Publication date: January 24, 2002Inventors: Joseph Fjelstad, John W. Smith, Thomas H. Distefano, James Zaccardi, A. Christian Walton
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Patent number: 6205660Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.Type: GrantFiled: April 22, 1997Date of Patent: March 27, 2001Assignee: Tessera, Inc.Inventors: Joseph Fjelstad, John W. Smith, Thomas H. Distefano, James Zaccardi, A. Christian Walton
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Patent number: 5934914Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.Type: GrantFiled: April 22, 1997Date of Patent: August 10, 1999Assignee: Tessera, Inc.Inventors: Joseph Fjelstad, John W. Smith, Thomas H. Distefano, James Zaccardi, A. Christian Walton
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Patent number: 5632631Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.Type: GrantFiled: September 14, 1994Date of Patent: May 27, 1997Assignee: Tessera, Inc.Inventors: Joseph Fjelstad, John W. Smith, Thomas H. Distefano, James Zaccardi, A. Christian Walton