Patents by Inventor James Zollo

James Zollo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7594318
    Abstract: A multilayer substrate assembly (80) includes at least one embedded component (52) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core dielectric (14), patterned conductive surfaces (12 and 16) on opposing sides of the core dielectric, and at least one hole (18) in each of at least two adjacently stacked pre-processed substrates such that at least two holes are substantially aligned on top of each other forming a single hole (19). The assembly further includes a processed adhesive layer (48) between top and bottom surfaces of respective pre-processed substrates. The embedded component is placed in the single hole and forms a gap (67 & 66) between the embedded component and a peripheral wall of the single hole. When the assembly is biased, the processed adhesive layer fills the gap to form the assembly having the embedded component cross-secting the plurality of pre-processed substrates.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: September 29, 2009
    Assignee: Motorola, Inc.
    Inventors: James A. Zollo, John K. Arledge, Nitin B. Desai
  • Publication number: 20080040921
    Abstract: A multilayer substrate assembly (80) includes at least one embedded component (52) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core dielectric (14), patterned conductive surfaces (12 and 16) on opposing sides of the core dielectric, and at least one hole (18) in each of at least two adjacently stacked pre-processed substrates such that at least two holes are substantially aligned on top of each other forming a single hole (19). The assembly further includes a processed adhesive layer (48) between top and bottom surfaces of respective pre-processed substrates. The embedded component is placed in the single hole and forms a gap (67 & 66) between the embedded component and a peripheral wall of the single hole. When the assembly is biased, the processed adhesive layer fills the gap to form the assembly having the embedded component cross-secting the plurality of pre-processed substrates.
    Type: Application
    Filed: September 12, 2007
    Publication date: February 21, 2008
    Applicant: MOTOROLA, INC.
    Inventors: JAMES ZOLLO, JOHN ARLEDGE, NITIN DESAI
  • Patent number: 7286366
    Abstract: A multilayer substrate assembly (80) includes at least one embedded component (52) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core dielectric (14), patterned conductive surfaces (12 and 16) on opposing sides of the core dielectric, and at least one hole (18) in each of at least two adjacently stacked pre-processed substrates such that at least two holes are substantially aligned on top of each other forming a single hole (19). The assembly further includes a processed adhesive layer (48) between top and bottom surfaces of respective pre-processed substrates. The embedded component is placed in the single hole and forms a gap (67 & 66) between the embedded component and a peripheral wall of the single hole. When the assembly is biased, the processed adhesive layer fills the gap to form the assembly having the embedded component cross-secting the plurality of pre-processed substrates.
    Type: Grant
    Filed: March 24, 2005
    Date of Patent: October 23, 2007
    Assignee: Motorola, Inc.
    Inventors: James A. Zollo, John K. Arledge, Nitin B. Desai
  • Publication number: 20060215379
    Abstract: A multilayer substrate assembly (80) includes at least one embedded component (52) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core dielectric (14), patterned conductive surfaces (12 and 16) on opposing sides of the core dielectric, and at least one hole (18) in each of at least two adjacently stacked pre-processed substrates such that at least two holes are substantially aligned on top of each other forming a single hole (19). The assembly further includes a processed adhesive layer (48) between top and bottom surfaces of respective pre-processed substrates. The embedded component is placed in the single hole and forms a gap (67 & 66) between the embedded component and a peripheral wall of the single hole. When the assembly is biased, the processed adhesive layer fills the gap to form the assembly having the embedded component cross-secting the plurality of preprocessed substrates.
    Type: Application
    Filed: March 24, 2005
    Publication date: September 28, 2006
    Applicant: Motorola, Inc.
    Inventors: James Zollo, John Arledge, Nitin Desai
  • Publication number: 20060146027
    Abstract: A keypad assembly for an electronic device where characters are displayed on the buttons has a flexible display laminate (105). The flexible display laminate has a driver layer (106) on which button regions of conductor (300) are formed. Surrounding the button regions are conductorless regions (312). The lack of conductor in the surrounding regions allows appropriate tactile feedback to a user when the user depresses an actuating member (112), through which character formed by the flexible display laminate may be seen, actuating a popple switch circuit which allows the device to detect the button press.
    Type: Application
    Filed: December 31, 2004
    Publication date: July 6, 2006
    Inventors: James Tracy, James Zollo
  • Publication number: 20060103404
    Abstract: A system includes a temperature chamber (100), a text fixture (402), a test coupon (400), a data acquisition unit (404), an ohmmeter (406) and a computer (410). The temperature chamber (100) provides temperature extremes to the test coupon (400). The test coupon (400) includes a substrate (314), one or more vias (418-429) and traces (402-412) connecting the vias. The data acquisition unit (404) continuously measures a resistance value of the circuit formed by the vias (418-429) and traces (402-412) during temperature cycling of the test coupon (400) held by the test fixture (402). The ohmmeter (406) measures the temperature of the test coupon (400) with a thermocouple. The data is used to detect failures of the materials in the test coupon (400) during the temperature cycling.
    Type: Application
    Filed: November 12, 2004
    Publication date: May 18, 2006
    Applicant: MOTOROLA, INC.
    Inventors: Nitin Desai, Paul Crandall, Ilya Lisak, Robert Mulligan, James Tracy, James Zollo
  • Patent number: 7025596
    Abstract: A method and apparatus form electrical connections between electronic circuits and conductive threads (102, 104, 106, 108) that are interwoven into textile material (130). Electronic circuits (128), such as semiconductor dies, are connected to a carrier (132) and electrical connections (136) are made to conductive connection areas (110, 112, 114, 116) on the carrier (132). Conductive stitching (202, 204, 206, 208) provides electrical contacts for both the conductive connection areas (110, 112, 114, 116) on the carrier (132) and the conductive threads (102, 104, 106, 108) that are interwoven into the textile material (130). Optionally, a thin, flexible substrate material (132) is perforated during the stitching process.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: April 11, 2006
    Assignee: Motorola, Inc.
    Inventors: James A. Zollo, Bonnie J. Bachman, Alan R. Beatty, Stephen O. Bozzone, Nitin B. Desai, Ronald J. Kelley, Rami C. Levy
  • Publication number: 20050277307
    Abstract: A method and apparatus form electrical connections between electronic circuits and conductive threads (102, 104, 106, 108) that are interwoven into textile material (130). Electronic circuits (128), such as semiconductor dies, are connected to a carrier (132) and electrical connections (136) are made to conductive connection areas (110, 112, 114, 116) on the carrier (132). Conductive stitching (202, 204, 206, 208) provides electrical contacts for both the conductive connection areas (110, 112, 114, 116) on the carrier (132) and the conductive threads (102, 104, 106, 108) that are interwoven into the textile material (130). Optionally, a thin, flexible substrate material (132) is perforated during the stitching process.
    Type: Application
    Filed: June 14, 2004
    Publication date: December 15, 2005
    Applicant: MOTOROLA, INC.
    Inventors: James Zollo, Bonnie Bachman, Alan Beatty, Stephen Bozzone, Nitin Desai, Ronald Kelley, Rami Levy
  • Patent number: 6972382
    Abstract: A multilayer circuit board (50) includes a plurality of substrate cores (34 and 44), an adhesive/bonding layer (55) between at least two among the plurality of substrate cores, and a microvia (35 and 45) in each of at least two of the plurality of substrate cores. The microvia includes a conductive interconnection (39) between a top conductive surface and a bottom conductive surface of each of the plurality of substrate cores and the microvia in a first substrate core is arranged to be inverted relative to a microvia in a second substrate core. The multilayer circuit board can further include a plated through-hole (54) through the plurality of substrate cores and the adhesive/bonding layer such that at least two among the top conductive surfaces (32 or 46) and the bottom conductive surfaces (36 or 42) of the plurality of substrate cores are connected.
    Type: Grant
    Filed: July 24, 2003
    Date of Patent: December 6, 2005
    Assignee: Motorola, Inc.
    Inventors: James A. Zollo, Nitin B. Desai
  • Publication number: 20050243522
    Abstract: A multi-purpose product packaging (100, 200) for an electronic host product (250) having its own casing can include an apparatus casing (110, 210) for removably and substantially encasing the electronic host product, circuitry (240) within the apparatus casing for providing at least one function to the electronic host product, and an interface (255) on the apparatus casing for enabling the at least one function to operate in conjunction with the electronic product. The apparatus casing can be made of recyclable products and the interface can form a portion of the circuitry within the apparatus casing. In one embodiment, the electronic host device can be a phone and the circuitry can provide any number of functions including the function of charging a power source within the phone.
    Type: Application
    Filed: April 30, 2004
    Publication date: November 3, 2005
    Applicant: Motorola, Inc.
    Inventors: Ryan Nilsen, James Tracy, Nitin Desai, James Zollo
  • Patent number: 6928726
    Abstract: A substrate assembly (10) and method of making same has at least one embedded component (25) in a via (24) of a substrate core (22) and includes a first adhesive layer (20) coupled to the substrate core, and a second adhesive layer (26) on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer (18) adhered to the bottom surface of the substrate core and a second conductive layer (28) on the second adhesive layer. The substrate assembly can further include an interconnection (36) between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening (34) that at least temporarily exposes at least a conductive surface (32) of the embedded component.
    Type: Grant
    Filed: July 24, 2003
    Date of Patent: August 16, 2005
    Assignee: Motorola, Inc.
    Inventors: James A. Zollo, John K. Arledge, John C. Barron, Gary R. Burhance, John Holley, Henry F. Liebman
  • Publication number: 20050016763
    Abstract: A substrate assembly (10) and method of making same has at least one embedded component (25) in a via (24) of a substrate core (22) and includes a first adhesive layer (20) coupled to the substrate core, and a second adhesive layer (26) on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer (18) adhered to the bottom surface of the substrate core and a second conductive layer (28) on the second adhesive layer. The substrate assembly can further include an interconnection (36) between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening (34) that at least temporarily exposes at least a conductive surface (32) of the embedded component.
    Type: Application
    Filed: July 24, 2003
    Publication date: January 27, 2005
    Inventors: James Zollo, John Arledge, John Barron, Gary Burhance, John Holley, Henry Liebman
  • Publication number: 20050016768
    Abstract: A multilayer circuit board (50) includes a plurality of substrate cores (34 and 44), an adhesive/bonding layer (55) between at least two among the plurality of substrate cores, and a microvia (35 and 45) in each of at least two of the plurality of substrate cores. The microvia includes a conductive interconnection (39) between a top conductive surface and a bottom conductive surface of each of the plurality of substrate cores and the microvia in a first substrate core is arranged to be inverted relative to a microvia in a second substrate core. The multilayer circuit board can further include a plated through-hole (54) through the plurality of substrate cores and the adhesive/bonding layer such that at least two among the top conductive surfaces (32 or 46) and the bottom conductive surfaces (36 or 42) of the plurality of substrate cores are connected.
    Type: Application
    Filed: July 24, 2003
    Publication date: January 27, 2005
    Inventors: James Zollo, Nitin Desai
  • Publication number: 20030058223
    Abstract: An adaptable keypad or button utilizes a display laminate made up of a driving layer (108), an electrically active ink layer (110), and a transparent conductor layer (112). In a preferred embodiment, the display laminate is placed between a switch (302, 303, 304) and an actuating member. The driving layer has a series of symbols or characters created by conductor patterns (202, 204, 208, 210) in the shape of the symbols or characters. Some of the conductor segments are used exclusively by one character, some are used exclusively by another character, and some may be common to both characters. The conductors making up the desired character or symbol to be displayed are electrically energized, causing a corresponding pattern in the electrically active ink layer to appear.
    Type: Application
    Filed: January 23, 2002
    Publication date: March 27, 2003
    Inventors: James L. Tracy, James A. Zollo, Bharat N. Vakil
  • Patent number: 6452811
    Abstract: Methods and apparatus for adding additional circuitry (19) to a circuit board (11) having a radiation shield (14) associated therewith include the additional circuitry (19) mounted onto a flex circuit (21) which in turn is mounted on the radiation shield (14). A conductor (32) containing portion (24) of the flex circuit (21) extends therefrom and is routed around and through a cutout (18) in the bottom surface of the radiation shield (14). The conductor (32) is connected to the printed circuit board (11) at the location of the cutout (18) in the radiation shield (14).
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: September 17, 2002
    Assignee: Motorola, Inc.
    Inventors: James L. Tracy, James A. Zollo
  • Patent number: 5495450
    Abstract: An integrated circuit (106) having an optically erasable portion (114) is joined to a substrate (102) such that the optically erasable portion faces the substrate. The substrate (102) includes an aperture (104) that exposes the optically erasable portion (114) of the integrated circuit providing erasing capability to the integrated circuit (106). A plug (110) impermeable to light may be inserted into the aperture (104) to provide a sealed window to the optically erasable portion (114) of the integrated circuit (106).
    Type: Grant
    Filed: November 25, 1994
    Date of Patent: February 27, 1996
    Assignee: Motorola, Inc.
    Inventors: James A. Zollo, Barbara R. Doutre, Rudy Yorio
  • Patent number: 5410181
    Abstract: An integrated circuit (106) having an optically erasable portion (114) is joined to a substrate (102) such that the optically erasable portion faces the substrate. The substrate (102) includes an aperture (104) that exposes the optically erasable portion (114) of the integrated circuit providing erasing capability to the integrated circuit (106). A plug (110) impermeable to light may be inserted into the aperture (104) to provide a sealed window to the optically erasable portion (114) of the integrated circuit (106).
    Type: Grant
    Filed: June 20, 1994
    Date of Patent: April 25, 1995
    Assignee: Motorola, Inc.
    Inventors: James A. Zollo, Barbara R. Doutre, Rudy Yorio
  • Patent number: 5172303
    Abstract: A stackable surface mount electronic component assembly 100 allowing for the stacking of electronic components 108, and 112 is disclosed. The stackable surface mount electronic component assembly 100 includes electronic component carriers 102, and 114, each having an electronic component 108, and 112 respectively. The two carriers 102, and 114, are electrically interconnected by the use of solder balls 106. Electronic component carrier 114 is in turn attached to an external printed circuit board by the use of solder balls 110. Optionally, each of the electronic components 108, 112 can be encapsulated using encapsulation material prior to the joining of the two carriers 102, and 114. In an alternate embodiment recesses 302 are located on top of the elevated peripheral edge 116 allowing for the proper alignment of the two carriers 102, and 114.
    Type: Grant
    Filed: November 23, 1990
    Date of Patent: December 15, 1992
    Assignee: Motorola, Inc.
    Inventors: Lonnie L. Bernardoni, James A. Zollo, Kenneth R. Thompson