Patents by Inventor Jamie A. Bayan

Jamie A. Bayan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS
    Publication number: 20120074561
    Abstract: One aspect of the invention pertains to an arrangement for forming exposed die packages. The arrangement includes a semiconductor wafer having multiple integrated circuit dice whose back surfaces cooperate to form the back surface of the wafer. A thermally conductive adhesive layer is deposited on the back surface of the wafer. The metal foil is attached to the wafer with the adhesive layer. Methods of forming exposed die packages using the above arrangement are also described.
    Type: Application
    Filed: September 27, 2010
    Publication date: March 29, 2012
    Applicant: NATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Nghia T. TU, Will K. WONG, Jamie A. BAYAN
  • Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package
    Patent number: 7259460
    Abstract: Aspects of the invention recite wire bonding on thinned portions of a lead-frame that is configured for use in an IC package. A harder lead-frame material, improved adhesive tape, and various structural features of the lead-frame itself, in various combinations or subcombinations, facilitate the attachment of wire bonds to thinned areas of the lead-frame. This eliminates the need for supports placed directly under the bond sites, removing unwanted conductive areas on the outer surface of an IC package.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: August 21, 2007
    Assignee: National Semiconductor Corporation
    Inventors: Jamie A. Bayan, Ashok S. Prabhu, Chan Peng Yeen, Hasfiza Ramley, Santhiran S/O Nadarajah