Abstract: A flexible transducer designed with high volume manufacturing in mind is described, the where flexible transducer mount can be panelized into a grid form and the transducers assembled into the grid using commercially available pick-and-place tools. Once assembled, the mounted transducers may be attached to circuit boards using surface mount processes such as solder reflow or adhesive bonding via the electrical contacts on the underside of the flexible transducer mount. Further, maximization of the oscillating internal surface area that contributes to the acoustic pressure for a given transducer footprint area is described, which leads to greater packing density of transducers when used in an ultrasonic array. The greater packing density and pressure generated by the transducer aids with the miniaturization and cost reduction of mid-air haptic technology.

Abstract: Described herein is mechanically decoupling of an electromechanical transducer from a common substrate, enabling multiple transducers to be surface mounted to a common substrate such as a printed circuit board (PCB) without experiencing mechanical cross-coupling. The decoupling of the transducer from the substrate enables the transducers to be attached without reducing the efficiency of acoustic transduction. The design of the mount enables it to be assembled in an automated manner with pick and place tools.