Patents by Inventor Jamie Hulan

Jamie Hulan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Supplemental heat conduction path for card to chassis heat dissipation
    Patent number: 6873528
    Abstract: A heat dissipation element which can be shaped as a flat plate for transfer of heat to the opposite side of a mounting channel in a chassis for holding circuit cards. Circuit cards are typically held in place in channels in a chassis by an expansion type retention device. The circuit cards also include a heat frame for collecting the heat produced by the card components and channeling the heat from the card through the heat frame to the chassis. The retention device presses the heat frame in to thermal contact with one side of the channel. The heat dissipation plate is held in thermal contact with the other side of the channel, providing a second additional heat path to channel heat away from individual components, the circuit card and/or the heat frame.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: March 29, 2005
    Assignee: Dy 4 Systems Ltd.
    Inventors: Jamie Hulan, David Perry, Ivan Straznicky
  • Supplemental heat conduction path for card to chassis heat dissipation
    Publication number: 20030223197
    Abstract: A heat dissipation element which can be shaped as a flat plate for transfer of heat to the opposite side of a mounting channel in a chassis for holding circuit cards. Circuit cards are typically held in place in channels in a chassis by an expansion type retention device. The circuit cards also include a heat frame for collecting the heat produced by the card components and channeling the heat from the card through the heat frame to the chassis. The retention device presses the heat frame in to thermal contact with one side of the channel. The heat dissipation plate is held in thermal contact with the other side of the channel, providing a second additional heat path to channel heat away from individual components, the circuit card and/or the heat frame.
    Type: Application
    Filed: July 29, 2002
    Publication date: December 4, 2003
    Applicant: Dy-04 Systems Ltd.
    Inventors: Jamie Hulan, David Perry, Ivan Stranznicky