Abstract: Systems and methods for detecting replay attacks on a biometric-based authentication system are disclosed herein. In some embodiments, the method includes generating a command set causing a fingerprint sensor to sequentially conduct a scan of pixels in the fingerprint sensor, wherein the command set includes one or more replay attack detection commands causing the fingerprint sensor to capture replay attack detection data, sending the commands to the fingerprint sensor, receiving fingerprint data, and evaluating the fingerprint data for the replay attack detection data. In some embodiments, the one or more replay attack detection commands include repeating the scan of a selected row of pixels, providing insufficient bias to a selected row of pixels, and/or providing too much bias to a selected row of pixels. In some embodiments, the replay attack detection commands are randomly generated for each scan. Various other aspects of the technology are described herein.

Abstract: Systems and methods for detecting replay attacks on a biometric-based authentication system are disclosed herein. In some embodiments, the method includes generating a command set causing a fingerprint sensor to sequentially conduct a scan of pixels in the fingerprint sensor, wherein the command set includes one or more replay attack detection commands causing the fingerprint sensor to capture replay attack detection data, sending the commands to the fingerprint sensor, receiving fingerprint data, and evaluating the fingerprint data for the replay attack detection data. In some embodiments, the one or more replay attack detection commands include repeating the scan of a selected row of pixels, providing insufficient bias to a selected row of pixels, and/or providing too much bias to a selected row of pixels. In some embodiments, the replay attack detection commands are randomly generated for each scan. Various other aspects of the technology are described herein.

Abstract: A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.

Abstract: A fingerprint sensing device includes a substrate; a plurality of pixels arranged in a grid of rows and columns, each pixel having an active thermal sensing element therein; a first metal layer forming first addressing lines for addressing the active thermal sensing elements; a second metal layer above the first metal layer and forming second addressing lines for addressing the active thermal sensing elements; an electrically conductive ESD protection layer; and an insulating layer disposed between the ESD protection layer and the active thermal sensing elements. The ESD protection layer is electrically connected to a bias potential. The ESD protection layer is disposed in a pattern such that it partially overlaps each pixel, the ESD protection layer at least partially overlapping the active thermal sensing element of each pixel.

Abstract: A fingerprint sensing device includes a substrate; a plurality of pixels arranged in a grid of rows and columns, each pixel having an active thermal sensing element therein; a first metal layer forming first addressing lines for addressing the active thermal sensing elements; a second metal layer above the first metal layer and forming second addressing lines for addressing the active thermal sensing elements; an electrically conductive ESD protection layer; and an insulating layer disposed between the ESD protection layer and the active thermal sensing elements. The ESD protection layer is electrically connected to a bias potential. The ESD protection layer is disposed in a pattern such that it partially overlaps each pixel, the ESD protection layer at least partially overlapping the active thermal sensing element of each pixel.

Abstract: A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.

Abstract: A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.

Abstract: A bore imaging system comprises a photodetector configuration and a first bore surface imaging arrangement configured to transmit image light arising from a first image zone on a bore surface to the photodetector. The photodetector configuration comprises a first curved photodetector arrangement which is curved in a plane that is oriented transverse to an axial direction of the bore. The first curved photodetector arrangement comprises a first imaging array that receives image light along a direction transverse to the axial direction.

Abstract: A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.

Abstract: A bore imaging system comprises a photodetector configuration and a first bore surface imaging arrangement configured to transmit image light arising from a first image zone on a bore surface to the photodetector. The photodetector configuration comprises a first curved photodetector arrangement which is curved in a plane that is oriented transverse to an axial direction of the bore. The first curved photodetector arrangement comprises a first imaging array that receives image light along a direction transverse to the axial direction.

Abstract: A detector configuration determines the direction of illumination incident on a photosensitive device. Multiple mask layers include holes which form an interlayer optical path through which radiation reaches a photodetector. The interlayer optical path provides a selected nominal maximum signal angle and the detector senses when radiation is received at or near that angle. In one embodiment, three holes in three metallization layers provide an arbitrarily narrow interlayer optical path with improved angular detection relative to that provided by two holes. An illumination direction-sensing array may use multiple instances of the detector configuration. The detector configuration may provide enhanced utility and economy by being adapted to use only those fabrication steps used for fabricating other primary circuits on an IC.

Abstract: A detector configuration determines the direction of illumination incident on a photosensitive device. Multiple mask layers include holes which form an interlayer optical path through which radiation reaches a photodetector. The interlayer optical path provides a selected nominal maximum signal angle and the detector senses when radiation is received at or near that angle. In one embodiment, three holes in three metallization layers provide an arbitrarily narrow interlayer optical path with improved angular detection relative to that provided by two holes. An illumination direction-sensing array may use multiple instances of the detector configuration. The detector configuration may provide enhanced utility and economy by being adapted to use only those fabrication steps used for fabricating other primary circuits on an IC.