Abstract: A cleaning mechanism for removing residual marking particles and other debris from a dielectric member of a reproduction apparatus and polish the dielectric member and remove fine scratches therefrom. The cleaning mechanism includes a substantially cylindrical fiber brush rotatable about its longitudinal axis with the fibers of the brush in contact with the dielectric member. A housing encloses that portion of the fiber brush not in contact with the dielectric member. The housing defines a substantially cylindrical chamber with the inner wall thereof spaced from the outer extremes of the brush fibers. In this manner, residual marking particles and debris are allowed to collect between the fibers of the brush to an extent sufficient to enable the fiber brush, when loaded with such marking particles and debris, to polish the dielectric member and remove fine scratches as the fibers clean the dielectric member.

Abstract: In accordance with the invention, there is provided an improved cleaning nozzle for use in a cleaning station of a reproduction apparatus. A vacuum is applied through the cleaning nozzle to remove debris from a cleaning brush located in the cleaning station. The cleaning nozzle, which protrudes into the brush, includes a member defining a slot through which the vacuum may be applied. The member has an essentially flat leading end which protrudes into the brush and which defines a tapered entrance to the slot. In a modification of the invention, the nozzle protrudes into the brush by a distance in the range of between about 0.025 cm and 0.050 cm, preferably 0.038 cm. Additionally, the entrance to the slot is tapered from the leading end by an angle of about between 50 and 70 degrees, preferably 60 degrees.