Patents by Inventor Jamie Shaffer

Jamie Shaffer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical encoder readhead configured to block stray light with dummy vias
    Patent number: 8723103
    Abstract: An optical readhead for measuring a displacement along a measuring axis direction between the readhead and a scale track comprises an illumination portion configured to output source light to the scale track and a monolithic detector configuration. The monolithic detector configuration comprises: a first track photodetector portion configured to receive scale light from the scale track; a first metal layer; a second metal layer; and a plurality of dummy vias between the first metal layer and the second metal layer. The plurality of dummy vias is arranged to block light transmission along a layer between the first and second metal layers, and the plurality of dummy vias is formed by the same process steps used to fabricate a plurality of active vias used to connect circuit elements on the monolithic detector configuration.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: May 13, 2014
    Assignee: Mitutoyo Corporation
    Inventor: Jamie Shaffer
  • OPTICAL ENCODER READHEAD CONFIGURED TO BLOCK STRAY LIGHT
    Publication number: 20130112859
    Abstract: An optical readhead for measuring a displacement along a measuring axis direction between the readhead and a scale track comprises an illumination portion configured to output source light to the scale track and a monolithic detector configuration. The monolithic detector configuration comprises: a first track photodetector portion configured to receive scale light from the scale track; a first metal layer; a second metal layer; and a plurality of dummy vias between the first metal layer and the second metal layer. The plurality of dummy vias is arranged to block light transmission along a layer between the first and second metal layers, and the plurality of dummy vias is formed by the same process steps used to fabricate a plurality of active vias used to connect circuit elements on the monolithic detector configuration.
    Type: Application
    Filed: November 8, 2011
    Publication date: May 9, 2013
    Applicant: MITUTOYO CORPORATION
    Inventor: Jamie Shaffer